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INTRODUCTION
TR7700QC SII 3D AOI 配备了多种电子制造产业应用所需的关键检测功能。该 3D AOI 具备易于设定的人性化程式编辑介面、灵活的 IPC-610 检测演算法，并符合最新的智能工厂标准。
• 具备电子零件与锡点检测核心功能的 3D AOI
• 使用者友善的程式编写与符合 IPC-610 的弹性演算法
• 业界领先的检测速度，最高可达 57 cm²/sec
• 高零件检测能力，3D 量测高度可达 40 mm
• 智慧工厂相容解决方案
Optical System
| Imaging Method |
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| Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Field of View |
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Inspection Performance
| Imaging Speed |
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| Height Resolution |
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| Max. Solder Height |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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| Z-Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Optical System
| Imaging Method |
Stop-and-Go |
| Top Camera |
12 MP High Speed Camera |
| Angle Camera |
N/A |
| Imaging Resolution |
10 µm, 12 µm, 15 µm (factory setting) |
| Lighting |
Multi-phase True Color LED |
| 3D Technology |
Quad Digital Fringe Projectors |
| Max. 3D Range |
40 mm |
Inspection Performance
| Imaging Speed |
@ 10 μm: 25 cm²/sec
@ 12 μm: 37 cm²/sec
@ 15 μm: 57 cm²/sec |
Motion Table & Control
| X-Axis Control |
Ballscrew + AC Servo with Motion Controller |
| Y-Axis Control |
Ballscrew + AC Servo with Motion Controller |
| Z-Axis Control |
Ballscrew + AC Servo with Motion Controller |
| X-Y Axis Resolution |
1 μm |
Board Handling
| Max PCB Size |
TR7700QC SII: 510 x 460 mm
TR7700MQC SII: 660 x 690 mm
TR7700L QC SII: 765 x 610 mm*
TR7700QC SII DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane
*Extra Large 2,000 x 610 mm max. PCB size available by customization and multi-stage mode (Memory Upgrade as Needed) |
| PCB Thickness |
0.6-5 mm |
| Max PCB Weight |
TR7700QC SII: 3 kg. Optional: 5kg
TR7700MQC SII: 3 kg. Optional: 5kg
TR7700L QC SII: 3 kg. Optional: 5 kg / 12 kg
TR7700QC SII DL: 3 kg. Optional: 5kg |
| Top Clearance |
50 mm |
| Bottom Clearance |
40 mm |
| Edge Clearance |
3 mm. Optional: 4 mm / 5 mm |
| Conveyor |
Inline Height: 880 – 920 mm
* Optional: 940-965 mm (SMEMA compatible) |
Inspection Functions
| Component |
Missing, Tombstoning, Billboarding, Polarity, Rotation, Shift, Wrong Marking (OCV), Defective, Upside Down, Extra Component, Foreign Material, Lifted Component |
| Solder |
Solder Fillet Height, Solder Volume %, Excess Solder, Insufficient Solder, Bridging, Through-hole Pins, Lifted Lead, Golden Finger Scratch/ Contamination |
Dimensions
| WxDxH |
TR7700QC SII: 1100 x 1720 x 1710 mm
TR7700MQC SII: 1250 x 1740 x 1710 mm
TR7700L QC SII: 1365 x 1720 x 1710 mm
TR7700QC SII DL: 1100 x 1820 x 1710 mm
Note: not including signal tower, signal tower height 515 mm |
| Weight |
TR7700QC SII: 910 kg
TR7700MQC SII: 992 kg
TR7700L QC SII: 1025 kg
TR7700QC SII DL: 960 kg |
Imaging System
| Camera |
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| X-ray Source |
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| Imaging Resolution |
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| Inspection Method |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
|
| X-Y Axis Resolution |
|
Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Dimensions
| WxDxH |
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| Weight |
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| Power Requirement |
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