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TR5001V SII SERIES
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TR5001QV SII
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INTRODUCTION
优越的 TR5001V SII系列多核心平行真空ICT + FCT解决方案,具突破性的性能,配有多达4个独立核心,可实现高产量的目的。TR5001V SII系列的长生命周期快速插拔治具,以及内建的自动校正和自我诊断功能,可确保长期的测试可靠性; 流程化的TRI智能编程软件,让使用者更直觉且易于操作。
• 多核心平行测试设计
• 可靠的真空治具测试
• 非多工数位每脚位1比1驱动/接收
• MDA扩充ICT和功能测试
• 高精准度与高产量
• 长生命周期快速插拔治具
Tester Specifications
Analog/hybrid test points |
TR5001QV SII: 4096
TR5001DV SII: 3328
TR5001V SII: 3456 |
Operating System |
Microsoft® Windows compatible PC with USB, Windows 10 |
Fixture Type |
Vacuum fixture with Quick Disconnection InterfaceStandard Testing Components |
Standard Testing Components
Analog Test Hardware |
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6-wire measurement switching matrix
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Programmable AC/DC/DC High voltage and current sources
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AC/DC voltage, DC current measurement
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Component R/L/C measurement
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Optional Components
Analog Hardware |
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TestJet vectorless open circuit detection
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Arbitrary Waveform Generator
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Digital Testing |
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Non-multiplexing 1:1 per pin architecture with independent per-pin level setting
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Serial Test Controller (STC) Programming
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DUT power supplies: 5 V@3 A, 3.3 V@3 A, 12 V@3A, -12 V@1 A and 24 V@3 A
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DPS Programmable DUT Power supply :
(1) DPS3514: 30Vmax/5Amax/100Wmax per channel /4CH per DPS
(2) DPS3122: 30Vmax/10Amax/200Wmax per channel /2CH per DPS
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Programmable DUT power supplies: 75 V / 8 A max, 200W maximum output power
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Includes BScan Chain Test, BScan Cluster Test, BScan Virtual Nails Test, BScan Virtual Chain Test and IEEE1149.6 Test
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Up to 8 High Speed Serial Ports, On-board Flash, EEPROM, MAC programming
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Yield Management System |
YMS 4.0 |
Dimensions
WxDxH |
900 x 1080 x 1336 mm
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Weight |
TR5001QV SII: 370 kg
TR5001DV SII: 350 kg
TR5001V SII: 350 kg |
Optical System
Imaging Method |
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Camera |
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Imaging Resolution |
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Lighting |
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3D Technology |
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Field of View |
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Inspection Performance
Imaging Speed |
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Height Resolution |
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Max. Solder Height |
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Motion Table & Control
X-Axis Control |
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Y-Axis Control |
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Z-Axis Control |
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X-Y Axis Resolution |
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Z-Axis Resolution |
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Board Handling
Max PCB Size |
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PCB Thickness |
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Max PCB Weight |
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Top Clearance |
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Bottom Clearance |
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Edge Clearance |
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Conveyor Height |
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Optical System
Imaging Method |
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Top Camera |
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Angle Camera |
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Imaging Resolution |
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Lighting |
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3D Technology |
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Max. 3D Range |
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Motion Table & Control
X-Axis Control |
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Y-Axis Control |
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Z-Axis Control |
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X-Y Axis Resolution |
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Board Handling
Max PCB Size |
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PCB Thickness |
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Max PCB Weight |
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Top Clearance |
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Bottom Clearance |
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Edge Clearance |
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Conveyor |
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Imaging System
Camera |
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X-ray Source |
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Imaging Resolution |
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Inspection Method |
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Motion Table & Control
X-Axis Control |
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Y-Axis Control |
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Z-Axis Control |
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X-Y Axis Resolution |
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Board Handling
Max PCB Size |
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PCB Thickness |
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Max PCB Weight |
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Top Clearance |
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Bottom Clearance |
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Edge Clearance |
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Conveyor Height |
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Dimensions
WxDxH |
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Weight |
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Power Requirement |
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