产品介绍

自动光学检测机 (AOI)

TR7700 SIII Ultra


TR7700 SIII Ultra

INTRODUCTION

TR7700 SIII Ultra 是最新的高产能 AOI，基于强化的机械平台构建，确保检测过程中的稳定性、准确性与精密度。这款高速 AOI 符合工业 4.0 解决方案，支援即将推出的创新协定，例如 IPC-CFX、IPC-Hermes-9852 及 IPC-DPMX。　

• 业界领先的检测速度，最高可达 120 cm²/sec
• 透过 TRI 的智能编程，可在数分钟内完成检测设定
• 高精度计量级量测技术
• 强化的机构设计，提升稳定性与精密度
• 支援闭环 (Closed Loop) 控制：具备反馈与前馈功能
• 具备即时 SPC 趋势的智慧工厂解决方案

Optical System

Imaging Method
Camera
Imaging Resolution
Lighting
3D Technology
Field of View

Inspection Performance

Imaging Speed
Height Resolution
Max. Solder Height

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Z-Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Defects
Measurement

Dimensions

WxDxH
Weight

Optical System

Imaging Method	Dynamic Imaging
Top Camera	4 MP / 9 MP / 12 MP High Speed Color Camera
Angle Camera	N/A
Imaging Resolution	5.5 µm, 6 µm , 10 µm , 15 µm (factory setting)
Lighting	Multi-phase RGB+W LED
3D Technology	3D Laser Sensor (Standard for 3D Models)
Max. 3D Range	N/A

Inspection Performance

Imaging Speed

4 MP@ 10 μm: up to 60 cm²/sec
4 MP@ 15 μm: up to 120 cm²/sec
9 MP@ 10 μm: up to 80 cm²/sec
12 MP@ 5.5 μm: up to 32 cm²/sec
12 MP@ 6 μm: up to 37 cm²/sec

Motion Table & Control

X-Axis Control	Ballscrew + AC Servo with Motion Controller
Y-Axis Control	Ballscrew + AC Servo with Motion Controller
Z-Axis Control	Ballscrew + AC Servo with Motion Controller
X-Y Axis Resolution	1 µm

Board Handling

Max PCB Size	TR7700 SIII Ultra (3D): 510 x 460 mm TR7700M SIII Ultra: 660 x 690 mm TR7700 SIII Ultra (3D) DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane
PCB Thickness	0.6-5 mm
Max PCB Weight	3 kg. Optional: 5 kg / 12 kg
Top Clearance	25 mm. Optional: 48 mm
Bottom Clearance	40 mm
Edge Clearance	3 mm. Optional: 4 mm / 5 mm
Conveyor	Inline Height: 880 – 920 mm * Optional: 940-965 mm (SMEMA compatible)

Inspection Functions

Component	Missing Tombstoning Billboarding Polarity Rotation Shift Wrong Marking (OCV) Defective Upside Down Extra Component Foreign Material
Solder	Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch/Contamination

Dimensions

WxDxH	TR7700 SIII Ultra (3D): 1100 x 1720 x 1710 mm TR7700M SIII Ultra: 1250 x 1888 x 1710 mm TR7700 SIII Ultra (3D) DL: 1100 x 1820 x 1710 mm Note: Not including signal tower
Weight	TR7700 SIII Ultra (3D): 940 kg TR7700M SIII Ultra: 992 kg TR7700 SIII Ultra (3D) DL: 960 kg

Imaging System

Camera
X-ray Source
Imaging Resolution
Inspection Method

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Capabilities
Defects

Dimensions

WxDxH
Weight
Power Requirement

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