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INTRODUCTION
TR8100H SII 系列是最新型的高阶电路板测试ICT，拥有数位无 MUX 架构 1:1 针点与检测点比例设计，可测试多达11,088个针点数。高程式设计性可以进行快速程式开发，工程变更修改更快速更简易；不占空间、高产量、高精度测试的特性，能有效率测试大针点数且复杂的低电压测试电路板(PCBA)，提高系统稳定度、长期的测试可靠度及故障覆盖率，以得到降低成本的目的，并能够将测试结果资料完整呈现。
• 真空治具高故障覆盖率测试解决方案
• 低电压装置测试与高速测试
• 内建自我诊断功能
• 高精度测量和测试
• 友善的操作界面，轻松的程序开发
Tester Specifications
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Analog test points |
TR8100H SII: 7056
TR8100HL SII: 11088
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Operating System |
Microsoft® Windows compatible PC, Windows 10 |
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Fixture Type |
Vacuum type |
Standard Testing Components
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Analog Test Hardware |
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6-wire measurement switching matrix
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Programmable AC/DC/DC High voltage and current sources
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AC/DC voltage, DC current measurement, frequency
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Component R/L/C measurement
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Synthesized Arbitrary Waveform Generator
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TestJet vectorless open circuit detection
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Digital Testing |
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Non-multiplexing 1:1 per pin architecture with independent per-pin level setting
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DUT power supplies: 5 V@5 A, 3.3 V@5 A, 12 V@5A, 0.2~20 V@3 A and -3~-20 V@3 A
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On-board Flash, EEPROM, MAC programming
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Optional Components
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Analog Hardware |
Fixture Conversion Kits for Teradyne, GenRad |
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Digital Testing |
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APPS Power Supplies: Programmable 75 V/8 A/200 W Max., 1 Channel
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Includes BScan Chain Test, BScan Cluster Test, BScan Virtual Nails Test, BScan Virtual Chain Test and IEEE1149.6 Test
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Serial Test Controller (STC) Programming
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DPS Programmable DUT Power supply:
(1) DPS3514: 30Vmax/5Amax/100Wmax per channel /4CH per DPS
(2) DPS3122: 30Vmax/10Amax/200Wmax per channel /2CH per DPS
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ToggleScan Test
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Yield Management System |
YMS 4.0 |
Dimensions
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WxDxH |
TR8100H SII: 1150 x 850 x 800 mm
TR8100HL SII: 1400 x 850 x 800 mm |
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Weight |
TR8100H SII: 390 kg
TR8100HL SII: 450 kg |
Optical System
| Imaging Method |
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| Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Field of View |
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Inspection Performance
| Imaging Speed |
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| Height Resolution |
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| Max. Solder Height |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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| Z-Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Optical System
| Imaging Method |
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| Top Camera |
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| Angle Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Max. 3D Range |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor |
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Imaging System
| Camera |
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| X-ray Source |
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| Imaging Resolution |
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| Inspection Method |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Dimensions
| WxDxH |
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| Weight |
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| Power Requirement |
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