产品介绍

3D 锡膏印刷自动光学检测机 (SPI)

TR7007 SII


TR7007 SII

INTRODUCTION

TR7007 SII是产业最快速的锡膏印刷检测机，检测速度高达180 cm²/sec。高精度在线型无阴影的锡膏印刷检测解决方案提供全3D检测，分辨率包含15 µm or 10 µm并具备高精度线型马达平台。此系统的特点包括closed loop function、强化的2D成像技术、自动板弯补偿功能与条纹光扫描技术。此系列亦有双轨架构之机型，在不增加机台落地空间下，大幅提升了生产线的产能。

• 业界最快速的锡膏印刷检测机
• 无阴影条纹光检测技术
• 光学分辨率提供10 µm 及 15 µm 两种选择
• X-Y table线性马达可提供无震动精确检测

Optical System

Imaging Method	Dynamic Imaging
Camera	4 Mpix
Imaging Resolution	10 µm or 15 µm (factory setting)
Lighting	RGB LED
3D Technology	2-way Fringe Pattern
Field of View	4 Mpix@ 10 µm: 20 x 20 mm 4 Mpix@ 15 µm: 30 x 30 mm

Inspection Performance

Imaging Speed	4 Mpix@ 10 µm: 80 cm²/sec 4 Mpix@ 15 µm: 180 cm²/sec
Height Resolution	0.4 µm
Max. Solder Height	@ 10 µm: 600 µm @ 15 µm: 550 µm

Motion Table & Control

X-Axis Control	Linear Motor and linear scale with DSP-based controller
Y-Axis Control	Ballscrew + AC-servo controller
Z-Axis Control	Ballscrew + AC-servo controller
X-Y Axis Resolution	0.5 µm
Z-Axis Resolution	1 µm

Board Handling

Max PCB Size	TR7007 SII: 510 x 460 mm TR7007LL SII: 850 x 610 mm
PCB Thickness	0.6-5 mm
Max PCB Weight	TR7007 SII: 3 kg TR7007LL SII: 5 kg
Top Clearance	40 mm
Bottom Clearance	40 mm
Edge Clearance	3 mm
Conveyor Height	880 – 920 mm * SMEMA Compatible

Inspection Functions

Defects	Insufficient Paste Excessive Paste Shape Deformity Missing Paste & Bridging
Measurement	Height Area Volume Offset

Dimensions

WxDxH	TR7007 SII: 1220 x 1663 x 1620 TR7007LL SII: 1600 x 1813 x 1637 mm Note: not including signal tower, signal tower height 520 mm
Weight	TR7007 SII: 920 kg TR7007LL SII: 1117 kg

Optical System

Imaging Method
Top Camera
Angle Camera
Imaging Resolution
Lighting
3D Technology
Max. 3D Range

Inspection Performance

Imaging Speed

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor

Inspection Functions

Component
Solder

Dimensions

WxDxH
Weight

Imaging System

Camera
X-ray Source
Imaging Resolution
Inspection Method

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Capabilities
Defects

Dimensions

WxDxH
Weight
Power Requirement

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