|
|
INTRODUCTION
The TR7600HP is a High-Power CT AXI system specifically designed for power modules, including IGBTs, MOSFETs, and SiC inverters. The 3D AXI advanced algorithms effectively remove heatsink shadows and noise, delivering clear and accurate inspection results. Equipped with AI-powered inspection algorithms, AI-Void Detection, and AI-driven programming, the TR7600HP enables precise and reliable defect detection. The TR7600HP is Smart Factory Ready, offering easy MES connectivity for seamless integration.
• High-Power 3D CT AXI for IGBT, Power Module, and Inverter Inspection
• AI-Powered Inspection Algorithms, AI-Void Detection, and AI-driven programming
• Flexible Multi-Resolution Platform: 7 – 30 μm production
• Inline Fine-Tuning without Interrupting Production
• Supports boards of up to 950 x 530 mm in size and up to 12 kg in weight
• Smart Factory Ready with Easy MES Connectivity
• Ease of Maintenance and Radiation Safe Design
• Communication Standard: SMEMA, SECS/GEM, IPC-CFX-2591, IPC-HERMES-9852
Optical System
| Imaging Method |
|
| Camera |
|
| Imaging Resolution |
|
| Lighting |
|
| 3D Technology |
|
| Field of View |
|
Inspection Performance
| Imaging Speed |
|
| Height Resolution |
|
| Max. Solder Height |
|
Motion Table & Control
| X-Axis Control |
|
| Y-Axis Control |
|
| Z-Axis Control |
|
| X-Y Axis Resolution |
|
| Z-Axis Resolution |
|
Board Handling
| Max PCB Size |
|
| PCB Thickness |
|
| Max PCB Weight |
|
| Top Clearance |
|
| Bottom Clearance |
|
| Edge Clearance |
|
| Conveyor Height |
|
Optical System
| Imaging Method |
|
| Top Camera |
|
| Angle Camera |
|
| Imaging Resolution |
|
| Lighting |
|
| 3D Technology |
|
| Max. 3D Range |
|
Motion Table & Control
| X-Axis Control |
|
| Y-Axis Control |
|
| Z-Axis Control |
|
| X-Y Axis Resolution |
|
Board Handling
| Max PCB Size |
|
| PCB Thickness |
|
| Max PCB Weight |
|
| Top Clearance |
|
| Bottom Clearance |
|
| Edge Clearance |
|
| Conveyor |
|
Imaging System
| Camera |
Flat Panel Detector |
| X-ray Source |
40 -180 kV |
| Imaging Resolution |
7 μm - 30 μm |
| Inspection Method |
2D, 2.5D, 3D Slicing, Planar CT (Optional) |
Motion Table & Control
| X-Axis Control |
High-precision ballscrew + AC-servo controller |
| Y-Axis Control |
High-precision ballscrew + AC-servo controller |
| Z-Axis Control |
High-precision ballscrew + AC-servo controller |
| X-Y Axis Resolution |
N/A |
Board Handling
| Max PCB Size |
950 x 530 mm |
| PCB Thickness |
0.4 - 7 mm |
| Max PCB Weight |
12 kg |
| Top Clearance |
@ 30 μm: 70 mm
@ 25 μm: 70 mm
@ 20 μm: 70 mm
@ 15 μm: 60 mm
@ 10 μm: 30 mm
@ 7 μm: 15 mm |
| Bottom Clearance |
70 mm |
| Edge Clearance |
3 mm or 5 mm |
| Conveyor Height |
880 - 920 mm. Optional: 940 - 965 mm |
Inspection Functions
| Capabilities |
BGAs, Backdrill, Barrel fill, Capacitors, Resistor, Chips, Components Under RF shields, WLCSP, DIMM Connectors, Flip-Chips, Ground Pads, Gullwing, Heat sinks, J-Leads , LED Chips, LGAs, RNET, SiP, SMT Connectors, SOIC, SOT, Thermal Pad, QFNs, QFP and THTs, IGBT |
| Defects |
Missing, Misalignment, Tombstone, Billboard, Tantalum Polarity, Rotation, Insufficient/Excess Solder, Bridging, Open, Solder Ball, Non-Wetting, Void and Lifted Lead |
Dimensions
| WxDxH |
1730 x 2300 x 1980 mm
* not including signal tower, height: 519 mm |
| Weight |
5500 kg |
| Power Requirement |
200 – 240 VAC, Single Phase, 50 / 60 Hz, 4 kVA |
|
站内搜寻
会员专区
