产品介绍

自动光学检测机 (AOI)

TR7500 SIII Ultra

INTRODUCTION

TR7500 SIII Ultra 整合了多镜头侧面检测、先进的 AI 驱动演算法* 以及计量级* 量测技术，实现高精度检测。凭借提升的机械性能，该系统在准确度方面表现卓越，能检测内层桥接与隐藏缺陷。这款智能工厂 AOI 确保了符合工业 4.0 标准且具成本效益的解决方案，提供全面的缺陷检测。　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　

• 多角度侧面检测，提供全面缺陷检测涵盖
• AI 驱动缺陷检测演算法*
• 搭配 TRI AOM* 的计量级量测
• 搭配雷射模组* 的 3D 轮廓量测
• 具备智能编程，设定简易
• 智慧工厂就绪解决方案

*选配功能

Optical System

Imaging Method
Camera
Imaging Resolution
Lighting
3D Technology
Field of View

Inspection Performance

Imaging Speed
Height Resolution
Max. Solder Height

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Z-Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Defects
Measurement

Dimensions

WxDxH
Weight

Optical System

Imaging Method	Dynamic Imaging
Top Camera	4 MP High Speed Color Camera
Angle Camera	4 Angled Cameras
Imaging Resolution	10 µm , 15 µm (factory setting)
Lighting	Multi-phase RGB+W LED
3D Technology	3D Laser Sensor (Optional)
Max. 3D Range	N/A

Inspection Performance

Imaging Speed

4 MP@ 10 μm: up to 60 cm²/sec
4 MP@ 15 μm: up to 120 cm²/sec

Motion Table & Control

X-Axis Control	Ballscrew + AC Servo with Motion Controller
Y-Axis Control	Ballscrew + AC Servo with Motion Controller
Z-Axis Control	Ballscrew + AC Servo with Motion Controller
X-Y Axis Resolution	1 μm

Board Handling

Max PCB Size	TR7500 SIII Ultra: 510 x 460 mm TR7500M SIII Ultra: 660 x 690 mm TR7500 SIII Ultra DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane
PCB Thickness	0.6-5 mm
Max PCB Weight	3 kg. Optional: 5 kg
Top Clearance	25 mm. Optional: 48 mm
Bottom Clearance	40 mm
Edge Clearance	3 mm. Optional: 4 mm / 5 mm
Conveyor	Inline Height: 880 – 920 mm * Optional: 940-965 mm (SMEMA compatible)

Inspection Functions

Component	Missing Tombstoning Billboarding Polarity Rotation Shift Wrong Marking (OCV) Defective Upside Down Extra Component Foreign Material
Solder	Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch/Contamination

Dimensions

WxDxH	TR7500 SIII Ultra: 1100 x 1720 x 1710 mm TR7500M SIII Ultra: 1250 x 1740 x 1710 mm TR7500 SIII Ultra DL: 1365 x 1720 x 1710 mm Note: Not including signal tower
Weight	TR7500 SIII Ultra: 940 kg TR7500M SIII Ultra: 992 kg TR7500 SIII Ultra DL: 960 kg

Imaging System

Camera
X-ray Source
Imaging Resolution
Inspection Method

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Capabilities
Defects

Dimensions

WxDxH
Weight
Power Requirement

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