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自动X射线检测机 (AXI)

TR7600F2D Plus


The 2.5D Inline AXI TR7600F2D Plus is built on a new mechanical platform for faster cycle time, 10% performance improvement compared to the previous model. High Resolution of 5 µm, the TR7600F2D Plus delivers full coverage inspection, ideally for inspection in the consumer electronics industry, such as mobile electronics manufacturing.
The TR7600F2D Plus can reliably detect defects in BGAs, Capacitors, Chips, WLCSP, DIMM Connectors, Flip-Chips, Ground Pads, Gullwing, Heat sinks, J-Leads, LED Chips, LGAs, Paladin Connector, Resistor, RNET, SiP, SMT Connectors, SOIC, SOT, Thermal Pad, QFNs, QFP and THTs.
• Next Generation Mechanical Design for Faster Cycle Time
• Flexible Multi-Resolution, Multi-Power in one Configuration
• New motion controller, for real-time measurements and ease of maintenance
• Improved 2D Camera for easier adjustments and less calibration
• Large Board Inspection, up to 900 mm x 520 mm
• Smart Factory Ready with MES Connectivity