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INTRODUCTION
The 2.5D Inline AXI TR7600F2D Plus is built on a new mechanical platform for faster cycle time, 10% performance improvement compared to the previous model. High Resolution of 5 µm, the TR7600F2D Plus delivers full coverage inspection, ideally for inspection in the consumer electronics industry, such as mobile electronics manufacturing.
The TR7600F2D Plus can reliably detect defects in BGAs, Capacitors, Chips, WLCSP, DIMM Connectors, Flip-Chips, Ground Pads, Gullwing, Heat sinks, J-Leads, LED Chips, LGAs, Paladin Connector, Resistor, RNET, SiP, SMT Connectors, SOIC, SOT, Thermal Pad, QFNs, QFP and THTs.
• Next Generation Mechanical Design for Faster Cycle Time
• Flexible Multi-Resolution, Multi-Power in one Configuration
• New motion controller, for real-time measurements and ease of maintenance
• Improved 2D Camera for easier adjustments and less calibration
• Large Board Inspection, up to 900 mm x 460 mm
• Smart Factory Ready with MES Connectivity
Optical System
| Imaging Method |
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| Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Field of View |
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Inspection Performance
| Imaging Speed |
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| Height Resolution |
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| Max. Solder Height |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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| Z-Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Optical System
| Imaging Method |
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| Top Camera |
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| Angle Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Max. 3D Range |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor |
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Imaging System
| Camera |
Flat Panel Detector |
| X-ray Source |
130 kV (User Adjustable) |
| Imaging Resolution |
5 μm, 10 μm, 15 μm, 20 μm, 25 μm, 30 μm |
| Inspection Method |
2D, 2.5D, Planar CT (optional) |
Motion Table & Control
| X-Axis Control |
High-precision ballscrew + AC-servo controller |
| Y-Axis Control |
High-precision ballscrew + AC-servo controller |
| Z-Axis Control |
High-precision ballscrew + AC-servo controller |
| X-Y Axis Resolution |
N/A |
Board Handling
| Max PCB Size |
900 x 520 mm |
| PCB Thickness |
0.5 - 7 mm |
| Max PCB Weight |
12 kg |
| Top Clearance |
@ 15/20/25/30 μm: 50 mm
@ 10 μm: 30 mm
@ 5 μm: 10 mm
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| Bottom Clearance |
50 mm |
| Edge Clearance |
3 mm or 5 mm |
| Conveyor Height |
880 - 920 mm
* SMEMA Compatible
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Inspection Functions
| Capabilities |
BGAs
Capacitors
Chips
WLCSP
DIMM Connectors
Flip-Chips
Ground Pads
Gullwing
Heat sinks
J-Leads
LED Chips
LGAs
Paladin Connector
Resistor
RNET
SiP
SMT Connectors
SOIC
SOT
Thermal Pad
QFNs
QFP
THTs |
| Defects |
Missing
Misalignment
Tombstone
Billboard
Tantalum Polarity
Rotation
Insufficient/Excess Solder
Bridging
Open
Solder Ball
Void |
Dimensions
| WxDxH |
1537 x 2160 x 1800 mm
Note: not including signal tower, height: 519.5 mm
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| Weight |
3150 kg |
| Power Requirement |
200 – 240 VAC, single phase, 50/60 Hz, 4 kVA |
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