产品介绍

防护涂层自动光学检测机 (CI AOI)

TR7700 SIII Ultra CI

INTRODUCTION

TR7700 SIII Ultra CI是优化制造商生产良率和实现工厂自动化的强大工具。TR7700 SIII Ultra CI先进的防护涂层检测功能，具有强化的光学设计和专业的多相位照明，可用于检测涂层缺陷问题，不但能够测量涂层厚度，更具有检测助焊剂和胶的能力。

• 多应用保护涂层检测解决方案
• 涂布区域自动学习智能编程功能
• 激光传感器高精度涂层厚度测量*
• 高生产量及高速检测
• 助焊剂和胶检测能力
• 智能工厂实时 SPC 趋势追踪

*选配项目

Optical System

Imaging Method	Dynamic Imaging
Top Camera	4 Mpix
Imaging Resolution	10 µm, 15 µm (factory setting)
Lighting	Multi-phase RGB+W+UV LED

Imaging Performance

Imaging Speed

@10 µm 2D: 60 cm²/sec
@15 µm 2D: 120 cm²/sec
@10 µm 2D+3D: 27 – 39 cm²/sec
@15 µm 2D+3D: 40 – 60 cm²/sec

Motion Table & Control

X-Y-Z Axis Control	Ballscrew + AC Servo with Motion Controller
X-Y-Z Axis Resolution	1 µm

Board Handling

Max PCB Size	500 x 460 mm
PCB Thickness	0.6-5 mm
Max PCB Weight	3 kg. Optional: 5 kg
Top Clearance	25 mm. Optional: 50 mm
Bottom Clearance	40 mm
Edge Clearance	3 mm. Optional: 5 mm
Conveyor	Inline Height: 880 – 920 mm * SMEMA Compatible

Inspection Functions

Component Defects	Missing Tombstoning Billboarding, Polarity Rotation Shift Wrong Marking (OCV) Defective Upside Down Extra Component Foreign Material Lifted Component
Solder Joint Defects	Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch / Contamination
Conformal Coating	Missing Coating Insufficient Coating Crack Bubble Splash Contamination Spill Coating Thickness Glue Height (3D Laser)

Dimensions

WxDxH	1100 x 1720 x 1710 mm Note: not including signal tower, signal tower height 515 mm
Weight	940 kg

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Optical System

Imaging Method
Camera
Imaging Resolution
Lighting
3D Technology
Field of View

Inspection Performance

Imaging Speed
Height Resolution
Max. Solder Height

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Z-Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Defects
Measurement

Dimensions

WxDxH
Weight

Optical System

Imaging Method
Top Camera
Angle Camera
Imaging Resolution
Lighting
3D Technology
Max. 3D Range

Inspection Performance

Imaging Speed

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor

Inspection Functions

Component
Solder

Dimensions

WxDxH
Weight

Imaging System

Camera
X-ray Source
Imaging Resolution
Inspection Method

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Capabilities
Defects

Dimensions

WxDxH
Weight
Power Requirement

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