产品介绍

3D 锡膏印刷自动光学检测机 (SPI)

TR7007 SII Ultra

INTRODUCTION

TR7007 SII Ultra 的检测速度在业界中处于领先地位，最高可达 180 cm²/sec，建立在强化的机械平台上，可确保检测过程中的稳定度、准确性和精确性。TR7007 SII Ultra 3D SPI 亦是一项工业4.0解决方案，可支持即将推出的创新协议，例如IPC Connected Factory Exchange（CFX）和IPC Hermes 9852标准。

• 业界领先的检测速度，最高可达180 cm² / sec
• 通过TRI智能编程快速进行检测
• 支持Closed Loop数据共享反馈和前馈功能
• 具有实时SPC趋势的智能工厂解决方案

Optical System

Imaging Method	Dynamic Imaging
Camera	4 Mpix
Imaging Resolution	10 μm, 15 µm (factory setting)
Lighting	RGB LED
3D Technology	2-way Fringe Pattern
Field of View	4 Mpix@ 10 µm: 20 x 20 mm 4 Mpix@ 15 µm: 30 x 30 mm

Inspection Performance

Imaging Speed	4 Mpix@ 10 µm: 80 cm²/sec 4 Mpix@ 15 µm: 180 cm²/sec
Height Resolution	0.4 µm
Max. Solder Height	@ 10 µm: 420 µm @ 15 µm: 385 µm

Motion Table & Control

X-Axis Control	Linear Motor and linear scale with DSP-based controller
Y-Axis Control	Ballscrew + AC-servo controller
Z-Axis Control	Ballscrew + AC-servo controller
X-Y Axis Resolution	0.5 µm
Z-Axis Resolution	1 µm

Board Handling

Max PCB Size	TR7007 SII Ultra: 510 x 460 mm TR7007 SII Ultra DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane
PCB Thickness	0.6-5 mm
Max PCB Weight	3 kg
Top Clearance	50 mm
Bottom Clearance	40 mm
Edge Clearance	3 mm
Conveyor Height	880 – 920 mm * SMEMA Compatible

Inspection Functions

Defects	Insufficient Paste Excessive Paste Shape Deformity Missing Paste & Bridging
Measurement	Height Area Volume Offset

Dimensions

WxDxH	TR7007 SII Ultra: 1100 x 1480 x 1600 TR7007 SII Ultra DL: 1100 x 1705 x 1600 mm Note: not including signal tower, signal tower height 512 mm
Weight	TR7007 SII Ultra: 740 kg TR7007 SII Ultra DL: 925 kg

Optical System

Imaging Method
Top Camera
Angle Camera
Imaging Resolution
Lighting
3D Technology
Max. 3D Range

Inspection Performance

Imaging Speed

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor

Inspection Functions

Component
Solder

Dimensions

WxDxH
Weight

Imaging System

Camera
X-ray Source
Imaging Resolution
Inspection Method

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Capabilities
Defects

Dimensions

WxDxH
Weight
Power Requirement

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