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自动X射线检测机 (AXI)



The TR7600 SV series is the newly released line scan 3D AXI, with up to 20% performance improvement compared to the award-winning TR7600 SIII series. Powered by AI Algorithms, the high-speed 3D AXI can precisely detect Void defects. With 7 µm high-resolution, the TR7600 SV series delivers a high yield rate inspection.

The robust platform is capable of fast image reconstruction and defect detection in BGAs, Barrel fill, Capacitors, Chips, Components Under RF shields, CSPs, DIMM Connectors, Flip-Chips, Ground Pads, Gullwing, Heat sinks, J-Leads , LED Chips, LGAs, Paladin Connector, Resistor, RNET, SiP, SMT Connectors, SOIC, SOT, Thermal Pad, QFNs, QFP and THTs.
• 7 µm High Performance Inspection, 20% Performance Improvement compared to previous model
• New motion controller, EtherCAT, for real-time measurements and ease of maintenance
• AI-Powered Inspection algorithms for precise defect detection
• Smart Factory Ready for Easy MES Connectivity
• Worldwide Technical Support Services