INTRODUCTION
新一代的高速在线型TR7600F3D SII自动X射线检测解决方案，检测速度比上一代产品可快达两倍至三倍，可检测最大至900mm x 460mm的大型电路板；在不影响生产线生产时间的情况下，可同时降低漏测和误判率。
• 5 µm 高精准全面缺陷检测
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Optical System
Imaging Method
Camera
Imaging Resolution
Lighting
3D Technology
Field of View
Inspection Performance
Imaging Speed
Height Resolution
Max. Solder Height
Motion Table & Control
X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Z-Axis Resolution
Board Handling
Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height
Optical System
Imaging Method
Top Camera
Angle Camera
Imaging Resolution
Lighting
3D Technology
Max. 3D Range
Motion Table & Control
X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Board Handling
Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor
Imaging System
Camera
Flat Panel Detector
X-ray Source
130 kV Max (User Adjustable)
Imaging Resolution
5 μm ,10 μm, 15 μm, 20 μm, 25 μm, 30 μm (Choose 3 Resolutions)
Inspection Method
2D, 2.5D, 3D Slicing, Planar CT (Optional)
Motion Table & Control
X-Axis Control
High-Precision Ballscrew + AC-Servo Controller
Y-Axis Control
High-Precision Ballscrew + AC-Servo Controller
Z-Axis Control
High-Precision Ballscrew + AC-Servo Controller
X-Y Axis Resolution
N/A
Board Handling
Max PCB Size
900 x 460 mm*
PCB Thickness
0.6 - 7 mm
Max PCB Weight
12 kg
Top Clearance
@ 20/25/30 μm: 50 mm
Bottom Clearance
@ 30 μm: 55 mm
Edge Clearance
3 mm or 5 mm
Conveyor Height
880 - 920 mm
Inspection Functions
Component
Missing
Solder
Insufficient/Excess Solder
Dimensions
WxDxH
1470 x 1971 x 1974 mm
Weight
3850 kg
Power Requirement
200 - 240 VAC single phase, 50/60 Hz, 4 kVA
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