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INTRODUCTION
新一代的高速在线型TR7600F3D SII自动X射线检测解决方案，检测速度比上一代产品可快达两倍至三倍，可检测最大至900mm x 460mm的大型电路板；在不影响生产线生产时间的情况下，可同时降低漏测和误判率。
• 5 µm 高精准全面缺陷检测
• 新一代机械设计提供更快的速度，最高可达10 FOV/s
• 方便整合于智能工厂的MES串接
Optical System
| Imaging Method |
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| Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Field of View |
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Inspection Performance
| Imaging Speed |
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| Height Resolution |
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| Max. Solder Height |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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| Z-Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Optical System
| Imaging Method |
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| Top Camera |
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| Angle Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Max. 3D Range |
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Motion Table & Control
| X-Axis Control |
|
| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
|
Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor |
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Imaging System
| Camera |
Flat Panel Detector |
| X-ray Source |
130 kV Max (User Adjustable) |
| Imaging Resolution |
5 μm ,10 μm, 15 μm, 20 μm, 25 μm, 30 μm (Choose 3 Resolutions) |
| Inspection Method |
2D, 2.5D, 3D Slicing, Planar CT (Optional) |
Motion Table & Control
| X-Axis Control |
High-Precision Ballscrew + AC-Servo Controller |
| Y-Axis Control |
High-Precision Ballscrew + AC-Servo Controller |
| Z-Axis Control |
High-Precision Ballscrew + AC-Servo Controller |
| X-Y Axis Resolution |
1 µm |
Board Handling
| Max PCB Size |
900 x 460 mm*
* The Max. PCB Size will vary depending on the angle of incidence |
| PCB Thickness |
0.6 - 7 mm |
| Max PCB Weight |
12 kg |
| Top Clearance |
@ 20/25/30 μm: 50 mm
@ 15 μm: 45 mm
@ 10 μm: 25 mm
@ 5 μm: 5 mm |
| Bottom Clearance |
@ 30 μm: 55 mm
@ 5/10/15/20/25 μm: 70 mm |
| Edge Clearance |
3 mm or 5 mm |
| Conveyor Height |
880 - 920 mm
* SMEMA Compatible |
Inspection Functions
| Component |
Missing
Misalignment
Tombstone
Billboard
Tantalum Polarity
Rotation
Floating |
| Solder |
Insufficient/Excess Solder
Bridging
Open
Solder Ball
Non-wetting
Void
Lifted Lead |
Dimensions
| WxDxH |
1470 x 1971 x 1974 mm
Note: not including signal tower, height: 510 mm |
| Weight |
3850 kg |
| Power Requirement |
200 - 240 VAC single phase, 50/60 Hz, 4 kVA |
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