产品介绍

3D 锡膏印刷自动光学检测机 (SPI)

TR7007 SII Plus


TR7007 SII Plus

INTRODUCTION

TR7007 SII Plus是产业最快速的锡膏印刷检测机，检测速度高达200 cm²/sec。高精度在线型无阴影的锡膏印刷检测解决方案提供全3D检测，分辨率包含15 µm or 10 µm并具备高精度线型马达平台。此系统的特点包括closed loop function、强化的2D成像技术、自动板弯补偿功能与条纹光扫描技术。TRI快速且直觉化的操作介面提供简易编程、容易操作的优点，为您的生产线带来最大的价值。

• 业界最快速的锡膏印刷检测机
• 无阴影条纹光检测技术
• 光学分辨率提供10 µm 及 15 µm 两种选择
• 线性马达设计可提供无震动精确检测
• 先进的SPC功能提供生产质量监测与评估

Optical System

Imaging Method	Dynamic Imaging
Camera	4 Mpix
Imaging Resolution	10 µm or 15 µm (factory setting)
Lighting	RGB LED
3D Technology	2-way Fringe Pattern
Field of View	4 Mpix@ 10 µm: 20 x 20 mm 4 Mpix@ 15 µm: 30 x 30 mm

Inspection Performance

Imaging Speed	4 Mpix@ 10 µm: 90 cm²/sec 4 Mpix@ 15 µm: 200 cm²/sec
Height Resolution	0.4 µm
Max. Solder Height	@ 10 µm: 600 µm @ 15 µm: 550 µm

Motion Table & Control

X-Axis Control	Linear Motor and linear scale with DSP-based controller
Y-Axis Control	Ballscrew + AC-servo controller
Z-Axis Control	Ballscrew + AC-servo controller
X-Y Axis Resolution	0.5 µm
Z-Axis Resolution	1 µm

Board Handling

Max PCB Size	TR7007 SII Plus: 510 x 460 mm TR7007L SII Plus: 660 x 610 mm TR7007 SII Plus DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane
PCB Thickness	0.6-5 mm
Max PCB Weight	3 kg
Top Clearance	25 mm
Bottom Clearance	40 mm
Edge Clearance	3 mm
Conveyor Height	880 – 920 mm * SMEMA Compatible

Inspection Functions

Defects	Insufficient Paste Excessive Paste Shape Deformity Missing Paste & Bridging
Measurement	Height Area Volume Offset

Dimensions

WxDxH	TR7007 SII Plus: 1100 x 1570 x 1550 TR7007L SII Plus: 1300 x 1610 x 1560 mm TR7007 SII Plus DL: 1100 x 1770 x 1560 mm Note: not including signal tower, signal tower height 520 mm
Weight	TR7007 SII Plus: 950 kg TR7007L SII Plus: 1250 kg TR7007 SII Plus DL: 1100 kg

Optical System

Imaging Method
Top Camera
Angle Camera
Imaging Resolution
Lighting
3D Technology
Max. 3D Range

Inspection Performance

Imaging Speed

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor

Inspection Functions

Component
Solder

Dimensions

WxDxH
Weight

Imaging System

Camera
X-ray Source
Imaging Resolution
Inspection Method

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Capabilities
Defects

Dimensions

WxDxH
Weight
Power Requirement

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