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INTRODUCTION
TR7700Q SII藉由TRI智能编程具有自动学习、灵活检测演算法和量测功能,可针对智能工厂应用进行精确的测量和数据交换。此外,透过TR7700Q SII走停式取像技术与先进的平台稳定性,可得到更高的检测精准度和完善的Gauge R&R数值。
• 业界领先的检测速度,可达57 cm2 / sec
• 多重3D检测技术
• 完善的GR&R数值提供高精准检测
Optical System
Imaging Method |
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Camera |
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Imaging Resolution |
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Lighting |
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3D Technology |
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Field of View |
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Inspection Performance
Imaging Speed |
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Height Resolution |
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Max. Solder Height |
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Motion Table & Control
X-Axis Control |
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Y-Axis Control |
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Z-Axis Control |
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X-Y Axis Resolution |
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Z-Axis Resolution |
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Board Handling
Max PCB Size |
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PCB Thickness |
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Max PCB Weight |
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Top Clearance |
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Bottom Clearance |
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Edge Clearance |
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Conveyor Height |
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Optical System
Imaging Method |
Stop-and-Go |
Top Camera |
12 MP/21 MP High Speed Camera |
Angle Camera |
N/A |
Imaging Resolution |
5.5 µm *, 9.8 µm, 10 µm, 12 µm, 15 µm (factory setting)
* Available for TR7700Q SII & TR7700Q SII DL |
Lighting |
Multi-phase True Color LED |
3D Technology |
Quad Digital Fringe Projectors |
Max. 3D Range |
@ 5.5 μm: 20 mm @ 9.8 μm: 20 mm @ 10 μm: 40 mm @ 12 μm: 40 mm @ 15 μm: 40 mm |
Inspection Performance
Imaging Speed |
@ 5.5 μm: 7.8 cm²/sec @ 9.8 μm: 40 cm²/sec @ 10 μm: 25 cm²/sec @ 12 μm: 37 cm²/sec @ 15 μm: 57 cm²/sec |
Motion Table & Control
X-Axis Control |
Ballscrew + AC Servo with Motion Controller |
Y-Axis Control |
Ballscrew + AC Servo with Motion Controller |
Z-Axis Control |
Ballscrew + AC Servo with Motion Controller |
X-Y Axis Resolution |
1 μm |
Board Handling
Max PCB Size |
TR7700Q SII: 510 x 460 mm TR7700LQ SII: 765 x 610 mm TR7700Q SII DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane |
PCB Thickness |
0.6-5 mm |
Max PCB Weight |
TR7700Q SII: 3 kg. Optional: 5kg TR7700LQ SII: 3 kg (6.61 lb). Optional: 5 kg (11.02 lb) / 12 kg (26.46 lb) TR7700Q SII DL: 3 kg. Optional: 5kg |
Top Clearance |
@ 5.5 μm: 20 mm @ 9.8 μm: 50 mm @ 10 μm: 50 mm @ 12 μm: 50 mm @ 15 μm: 50 mm |
Bottom Clearance |
40 mm |
Edge Clearance |
3 mm. Optional: 4 mm / 5 mm |
Conveyor |
Inline Height: 880 – 920 mm
* Optional: 940-965 mm (SMEMA compatible) |
Inspection Functions
Component |
Missing, Tombstoning, Billboarding, Polarity, Rotation, Shift, Wrong Marking (OCV), Defective, Upside Down, Extra Component, Foreign Material, Lifted Component |
Solder |
Solder Fillet Height, Solder Volume %, Excess Solder, Insufficient Solder, Bridging, Through-hole Pins, Lifted Lead, Golden Finger Scratch/ Contamination |
Dimensions
WxDxH |
TR7700Q SII: 1100 x 1720 x 1710 mm TR7700LQ SII: 1365 x 1720 x 1710 mm TR7700Q SII DL: 1100 x 1820 x 1710 mm
Note: not including signal tower, signal tower height 515 mm |
Weight |
TR7700Q SII: 910 kg TR7700LQ SII: 1025 kg TR7700Q SII DL: 960 kg |
Imaging System
Camera |
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X-ray Source |
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Imaging Resolution |
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Inspection Method |
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Motion Table & Control
X-Axis Control |
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Y-Axis Control |
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Z-Axis Control |
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X-Y Axis Resolution |
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Board Handling
Max PCB Size |
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PCB Thickness |
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Max PCB Weight |
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Top Clearance |
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Bottom Clearance |
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Edge Clearance |
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Conveyor Height |
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Dimensions
WxDxH |
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Weight |
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Power Requirement |
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