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INTRODUCTION
TR5001 SII LED系列为TRI最新的ICT + FCT创新技术，专用于LED照明测试，拥有多达1080个LED测试通道。 ICT + FCT解决方案可提供多达4个独立核心的高性能多核心平行测试，配有长生命周期快速插拔治具，以及内置的自动校正和自我诊断功能，可确保长期的测试可靠性。 TR5001 SII LED系列是汽车业LED照明测试的最佳首选。
• 多核心平行测试设计
• 内置LED测试
• 非多工数位每脚位1比1驱动/接收
• MDA扩充ICT和功能测试
• 高精准度与高产量
• 多达1080个LED测试通道
• 长生命周期快速插拔治具
• 输送带宽度自动定位
• 板弯和错位通报
Tester Specifications
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Analog/hybrid test points |
2048 |
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Operating System |
Microsoft® Windows compatible PC with USB, Windows 10 |
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Fixture Type |
Inline or Offline with Long Lifespan Quick Disconnection Interface |
Standard Testing Components
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Analog Test Hardware |
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6-wire measurement switching matrix
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Programmable AC/DC/DC High voltage and current sources
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AC/DC voltage, DC current measurement
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Component R/L/C measurement
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In-Tester LED Analyzer
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Repeatability |
1% |
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LED Channels |
Up to 1080 LED Test channels. (Top: up to 540 / Bottom: up to 540.) |
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Fixture Connection |
Quick Disconnection Interface (QDI) |
Optional Components
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Analog Hardware |
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TestJet vectorless open circuit detection
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Arbitrary Waveform Generator
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Digital Testing |
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Non-multiplexing 1:1 per pin architecture with independent per-pin level setting
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Serial Test Controller (STC) Programming
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DUT power supplies: 5 V@3 A, 3.3 V@3 A, 12 V@3A, -12 V@1 A and 24 V@3 A
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DPS Programmable DUT Power supply :
(1) DPS3514: 30Vmax/5Amax/100Wmax per channel /4CH per DPS
(2) DPS3122: 30Vmax/10Amax/200Wmax per channel /2CH per DPS
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Programmable DUT power supplies: 75 V / 8 A max, 200W maximum output power
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Includes BScan Chain Test, BScan Cluster Test, BScan Virtual Nails Test, BScan Virtual Chain Test and IEEE1149.6 Test
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Up to 8 High Speed Serial Ports, On-board Flash, EEPROM, MAC programming
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Yield Management System |
YMS 4.0 |
Board Handling
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Min. PCB Size |
70 x 70 mm |
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Max. PCB Size |
500 x 460 mm |
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PCB Thickness |
0.6 - 5 mm |
Dimensions
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WxDxH |
TR5001(D/Q) SII INLINE: 900 x 1180 x 1887 mm*
TR5001(D/Q) SII QDI: 1200 x 950 x1850 mm
Note: not including signal tower,signal tower height: 392 mm
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Weight |
TR5001(D/Q) SII INLINE: 670 kg
TR5001(D/Q) SII QDI: 510 kg
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Optical System
| Imaging Method |
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| Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Field of View |
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Inspection Performance
| Imaging Speed |
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| Height Resolution |
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| Max. Solder Height |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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| Z-Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Optical System
| Imaging Method |
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| Top Camera |
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| Angle Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Max. 3D Range |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor |
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Imaging System
| Camera |
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| X-ray Source |
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| Imaging Resolution |
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| Inspection Method |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Dimensions
| WxDxH |
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| Weight |
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| Power Requirement |
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