产品介绍

自动光学检测机 (AOI)

TR7700Q

INTRODUCTION

TR7700Q 3D AOI 拥有数位四向条纹光投影技术，结合最新颖的2D+3D 检测技术，为组装电路板检测领域掀起全新革命。全方位3D数位条纹光技术涵盖检测范围广阔，拥有极佳的精准性呈现极小共面缺陷及焊点问题。 TRI的3D锡点及爬锡检测符合IPC标准，确保爬锡的品质。藉由检查爬锡高度及体积，TR7700Q 3D AOI可检测出少锡、缺锡、空焊等不良现象。

• 超高精准度 2D+3D AOI 走停式取像
• 爬锡高度及体积检测功能

• 清晰且可靠的3D四光源数位条纹光

• 可变频3D检测范围高度高达 30 mm

• 免空压智能化自动运输送带系统(IACS)

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Optical System

Imaging Method
Camera
Imaging Resolution
Lighting
3D Technology
Field of View

Inspection Performance

Imaging Speed
Height Resolution
Max. Solder Height

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Z-Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Defects
Measurement

Dimensions

WxDxH
Weight

Optical System

Imaging Method	Stop-and-Go Imaging
Top Camera	4 Mpix or 12 Mpix (factory setting)
Angle Camera	N/A
Imaging Resolution	5.5 µm, 10 µm, 15 µm (factory setting)
Lighting	Multi-phase True Color LED
3D Technology	Quad Digital Fringe Projectors
Max. 3D Range	4 Mpix@ 15 µm: 0-30 mm* 12 Mpix@ 5.5 µm: 0-4 mm 12 Mpix@ 10 µm: 0-30 mm* *Need GPU card upgrade

Inspection Performance

Imaging Speed

4 Mpix@ 15 µm: 21 cm²/sec
12 Mpix@ 5.5 µm: 4.3 cm²/sec (2D only: 12.2 cm²/sec)
12 Mpix@ 10 µm: 14.5 cm²/sec
12 Mpix@ 10 µm: 23 cm²/sec with optional CoaXPress

Note: Depending on component distribution

Motion Table & Control

X-Axis Control	Ballscrew + AC-servo controller
Y-Axis Control	Ballscrew + AC-servo controller
Z-Axis Control	Ballscrew + AC-servo controller
X-Y Axis Resolution	1 μm

Board Handling

Max PCB Size	TR7700QI @ 5.5 µm: 330 x 330 mm* TR7700QI @ 10 µm, 15 µm: 510 x 460 mm TR7700QI DL @ 10 µm, 15 µm: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane *Depending on component distribution, the vailable PCB size could be different
PCB Thickness	0.6-5 mm
Max PCB Weight	3 kg
Top Clearance	5.5 µm: 25 mm 10 µm: 50 mm 15 µm: 40 mm
Bottom Clearance	40 mm [100 mm optional]
Edge Clearance	3 mm [5 mm optional]
Conveyor	Inline Height: 880 – 920 mm * SMEMA Compatible

Inspection Functions

Component	Missing Tombstoning Billboarding Polarity Rotation Shift Wrong Marking (OCV) Defective Upside Down Extra Component Foreign Material Lifted Component
Solder	Solder Fillet Height Solder Volume % Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch/Contamination

Dimensions

WxDxH	TR7700Q: 1000 x 1400 x 1650 mm TR7700Q DL: 1000 x 15000 x 1650 mm Note: not including signal tower, signal tower height 520 mm
Weight	TR7700Q: 650 kg TR7700Q DL: 685 kg

Imaging System

Camera
X-ray Source
Imaging Resolution
Inspection Method

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Capabilities
Defects

Dimensions

WxDxH
Weight
Power Requirement

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