产品介绍

自动光学检测机 (AOI)

TR7700QE

INTRODUCTION

TR7700QE AOI 藉由结合以四向可调变数位条纹光投影为基础的新世代2D和3D技术，提供了优越的3D锡点和元件组装检测功能。最新的检测软体采用快速CAD资料的编程及高度可客制化模板。

• 优越的2D+3D检测覆盖率

• 四向数位条纹光投影

• 3D高度检测范围可高达40 mm

• 高速CoaXPress取像

• 可选配3D雷射模组

Optical System

Imaging Method
Camera
Imaging Resolution
Lighting
3D Technology
Field of View

Inspection Performance

Imaging Speed
Height Resolution
Max. Solder Height

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Z-Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Defects
Measurement

Dimensions

WxDxH
Weight

Optical System

Imaging Method	Stop-and-Go Imaging
Top Camera	12 Mpix
Angle Camera	N/A
Imaging Resolution	10 µm, 15 µm (factory setting)
Lighting	Multi-phase true color LED, Coaxial lighting
3D Technology	Quad Digital Fringe Projectors
Max. 3D Range	0-40 mm* * Requires Z axis control. The default 3D height is 0 – 20mm

Inspection Performance

Imaging Speed

12 Mpix@ 10 µm: 13.5 cm²/sec
12 Mpix@ 10 µm: 23 cm²/sec with optional CoaXPress
12 Mpix@ 15 µm: 30 cm²/sec
12 Mpix@ 15 µm: 50 cm²/sec with optional CoaXPress

Note: Depending on component distribution

Motion Table & Control

X-Axis Control	Ballscrew + AC-servo controller (Linear motor optional)
Y-Axis Control	Dual driven ballscrew + AC-servo controller
Z-Axis Control	Ballscrew + AC-servo controller (optional)
X-Y Axis Resolution	1 µm

Board Handling

Max PCB Size	TR7700QE: 510 x 460 mm TR7700L QE: 660 x 610 mm TR7700QE DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane
PCB Thickness	0.6-5 mm
Max PCB Weight	3 kg
Top Clearance	50 mm
Bottom Clearance	40 mm
Edge Clearance	3 mm [5 mm optional]
Conveyor	Missing Tombstoning Billboarding Polarity Rotation Shift Wrong Marking (OCV) Defective Upside Down Extra Component Foreign Material Lifted Component

Inspection Functions

Component	Solder Fillet Height Solder Volume % Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch/Contamination
Solder	Solder Fillet Height Solder Volume % Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch/Contamination

Dimensions

WxDxH	TR7700QE: 1100 x 1730 x 1750 mm TR7700L QE: 1250 x 1880 x 1750 mm TR7700QE DL: 1100 x 1830 x 1750 mm Note: not including signal tower, signal tower height 520 mm
Weight	TR7700QE: 920 kg TR7700L QE: 1170 kg TR7700QE DL: 950 kg

Imaging System

Camera
X-ray Source
Imaging Resolution
Inspection Method

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Capabilities
Defects

Dimensions

WxDxH
Weight
Power Requirement

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