|
|
TR5001 INLINE
 |
|
|
|
TR5001 INLINE
|
|
|
INTRODUCTION
最理想的在线组装电路板测试机，符合SMEMA标准可做为PCBAs测试之可扩充平台。TR5001 INLINE可以依客户的测试需求，提供经济客制化的测试解决方案，并且可完全满足大多数客户之测试要求。TR5001 INLINE整合MDA和可选择性的 ICT及Functional测试功能于同一平台，可以精简人力，缩短测试时间并提高产能。
• 模组化升级选项，可将MDA设备升级至ICT与功能测试系统
• 符合SMEMA标准规范之在线高测试覆盖率解决方案
• 少量测点之解决方案与PXI模块功能测试扩充
• 人性化界面搭配快速又简单的程序发展
Tester Specifications
|
Analog/hybrid test points |
3200 analog or maximum digital test points: 1600 |
|
Operating System |
Microsoft® Windows 10 |
|
Fixture Type |
Inline with long lifespan Quick Disconnection Interface |
Standard Testing Components
|
Analog Test Hardware |
-
6-wire measurement switching matrix
-
Measures voltage, current and frequency
-
Component R/L/C/D measurement
-
60 V high voltage current source for LED strip testing
|
Optional Components
|
Analog Hardware |
-
TestJet vectorless open circuit detection
-
Arbitrary Waveform Generator
|
|
Digital Testing |
-
Non-multiplexing 1:1 per pin architecture with independent per-pin level setting
-
DUT power supplies: 5 V@3 A, 3.3 V@3 A, 12 V@3A, -12 V@1 A and 24 V@3 A
-
Programmable DUT power supplies: 75 V / 8 A max, 200W maximum output power
-
Includes BScan Chain Test, BScan Cluster Test, BScan Virtual Nails Test, BScan Virtual Chain Test and IEEE1149.6 Test
-
On-board Flash, EEPROM, MAC programming
|
|
Yield Management System |
YMS 4.0 |
Board Handling
|
Min PCB Size |
70 x 70 mm |
|
Max PCB Size |
450 x 300 mm |
|
PCB Thickness |
0.6 - 5 mm |
Dimensions
|
WxDxH |
900 x 900 x 1645 mm
Note: not including signal tower, height: 515 mm |
|
Weight |
500 kg |
Optical System
| Imaging Method |
|
| Camera |
|
| Imaging Resolution |
|
| Lighting |
|
| 3D Technology |
|
| Field of View |
|
Inspection Performance
| Imaging Speed |
|
| Height Resolution |
|
| Max. Solder Height |
|
Motion Table & Control
| X-Axis Control |
|
| Y-Axis Control |
|
| Z-Axis Control |
|
| X-Y Axis Resolution |
|
| Z-Axis Resolution |
|
Board Handling
| Max PCB Size |
|
| PCB Thickness |
|
| Max PCB Weight |
|
| Top Clearance |
|
| Bottom Clearance |
|
| Edge Clearance |
|
| Conveyor Height |
|
Optical System
| Imaging Method |
|
| Top Camera |
|
| Angle Camera |
|
| Imaging Resolution |
|
| Lighting |
|
| 3D Technology |
|
| Max. 3D Range |
|
Motion Table & Control
| X-Axis Control |
|
| Y-Axis Control |
|
| Z-Axis Control |
|
| X-Y Axis Resolution |
|
Board Handling
| Max PCB Size |
|
| PCB Thickness |
|
| Max PCB Weight |
|
| Top Clearance |
|
| Bottom Clearance |
|
| Edge Clearance |
|
| Conveyor |
|
Imaging System
| Camera |
|
| X-ray Source |
|
| Imaging Resolution |
|
| Inspection Method |
|
Motion Table & Control
| X-Axis Control |
|
| Y-Axis Control |
|
| Z-Axis Control |
|
| X-Y Axis Resolution |
|
Board Handling
| Max PCB Size |
|
| PCB Thickness |
|
| Max PCB Weight |
|
| Top Clearance |
|
| Bottom Clearance |
|
| Edge Clearance |
|
| Conveyor Height |
|
Dimensions
| WxDxH |
|
| Weight |
|
| Power Requirement |
|
|
站内搜寻
会员专区
