产品介绍

自动光学检测机 (AOI)

TR7700Q TB SII

INTRODUCTION

TR7700Q TB SII 提供 3D 上视与 2D 下视检测，专为穿孔技术 (THT)、双列直插封装 (DiP) 及 SMD 缺陷的高覆盖率检测而设计。这款新发布的自动光学检测 (AOI) 设备配备了 TRI 创新的 AI 驱动演算法与计量级量测技术，可确保精准检测。此智能工厂就绪的解决方案具备资料交换能力，简化了 MES 串接，并支援目前的智能工厂标准，例如 IPC-CFX、IPC-DPMX 及 Hermes (IPC-HERMES-9852)。　

• 高速 3D 上视与 2D 下视 AOI，速度可达 57 cm2/sec
• 针对 THT/DIP 的高缺陷覆盖率检测
• 具备智能编程的 AI 驱动演算
• 计量级检测，实现精准测量
• 符合工业 4.0 标准

Optical System

Imaging Method	Stop-and-Go Imaging
Top Camera (3D)*	12 Mpix. Resolution: 10 µm, 15 µm
Bottom Camera (2D)*	6.5 Mpix. Resolution: 10 µm, 12.5 µm
3D Technology	Top: Quad Digital Fringe Projectors. Bottom: N/A
Max. 3D Height Range	40 mm
Lighting	Multi-phase True Color LED

Imaging Performance

Max. Imaging Speed

57 cm²/sec

Motion Table & Control**

X Axis Control	Ballscrew + AC Servo with Motion Controller
Y Axis Control	Ballscrew + AC Servo with Motion Controller
Z Axis Control	Ballscrew + AC Servo with Motion Controller
X-Y-Z Axis Resolution	1 µm

Board Handling

Max. PCB Size	510 x 510 mm
PCB Thickness	0.5-6 mm
Max. PCB Weight	3 kg. Optional: 5kg
Top Clearance	50mm
Bottom Clearance	40 mm
Conveyor	Inline Height: 880-920 mm. Optional: 940-965 mm Note: SMEMA Compatible

Inspection Functions

Component Defects	Missing Tombstoning Billboarding Polarity Rotation Shift Wrong Marking (OCV) Defective, Upside Down Extra Component Foreign Material Lifted Component
THT Defects	Missing Position Soldering Defects Pinhole Blowhole Pin Height Pin Angle Pin Offset Bridging Wetting
Solder Joint Defects	Solder Fillet Height Solder Volume % Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch/ Contamination

Dimensions

WxDxH	1200 x 2020 x 2000 mm Note: not including signal tower, signal tower height 488 mm
Weight	1720 kg
* Choose between Configuration 1: Top 12 MP 10 μm Bottom 6.5 M 10 μm or Configuration 2: Top 12 MP 15 μm Bottom 6.5 MP 12.5 μm. ** Optional: Z-Axis for Bottom-up; Linear Encoder Module; Dual Ball Screw + Servo Motor

Please login to access member content

Optical System

Imaging Method
Camera
Imaging Resolution
Lighting
3D Technology
Field of View

Inspection Performance

Imaging Speed
Height Resolution
Max. Solder Height

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Z-Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Defects
Measurement

Dimensions

WxDxH
Weight

Optical System

Imaging Method
Top Camera
Angle Camera
Imaging Resolution
Lighting
3D Technology
Max. 3D Range

Inspection Performance

Imaging Speed

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor

Inspection Functions

Component
Solder

Dimensions

WxDxH
Weight

Imaging System

Camera
X-ray Source
Imaging Resolution
Inspection Method

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Capabilities
Defects

Dimensions

WxDxH
Weight
Power Requirement

返回上一页