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INTRODUCTION
The TR7007D SII is a cutting-edge 3D SPI system designed to enhance your production processes. With its high-speed platform, the 3D SPI delivers up to 50% faster inspection compared to previous models, ensuring optimal efficiency. Experience improved accuracy and stability, allowing for precise solder measurements and minimizing false calls. Equipped with a wide spectrum light system and coaxial lighting*, the TR7007Q SII enhances contrast and detection rates, enabling you to capture intricate details with exceptional clarity. The 3D SPI is an Industry 4.0 Ready Solution supporting the upcoming and innovative protocols such as IPC Connected Factory Exchange (CFX) and IPC Hermes 9852 standard. (*Optional)
• Wide Spectrum Light for Enhanced Contrast and Detection Rate
• Improved Accuracy and Stability for Precise Solder Measurements
• New motion controller, EtherCAT, for real-time measurements
• 100% Shadow-free Dual Digital Fringe projectors
• SmartWarp Compensation Eliminates Local PCB Deformation
• Smart Factory solution with Real-time SPC Trends
• Closed Loop Ready: Feedback and Feed-forward Capabilities
Optical System
| Imaging Method |
Stop-and-Go Imaging |
| Camera |
21 Mpix |
| Imaging Resolution |
9.8 μm, 12.3 μm,15 μm (factory setting) |
| Lighting |
Wide Spectrum 2D Lights (RGB+W), Coaxial Lighting |
| 3D Technology |
2-way Digital Fringe Pattern |
| Field of View |
21 Mpix@ 9.8 μm: 50.30 x 40.24 mm
21 Mpix@ 12.3 μm: 62.97 x 50.38 mm
21 Mpix@ 15 μm: 76.8 x 61.4 mm |
Inspection Performance
| Imaging Speed |
21 Mpix@ 9.8 μm: 2.6 FOV/sec
21 Mpix@ 12.3 μm: 2.3 FOV/sec
21 Mpix@ 15 μm: 2.3 FOV/sec |
| Height Resolution |
21 Mpix@ 9.8 μm: 0.4 μm
21 Mpix@ 12.3 μm: 0.45 μm
21 Mpix@ 15 μm: 0.454 μm |
| Max. Solder Height |
21 Mpix@ 9.8 μm: 420 μm
21 Mpix@ 12.3 μm: 420 μm
21 Mpix@ 15 μm: 470 μm
* on Calibration Target |
Motion Table & Control
| X-Axis Control |
Ballscrew + AC Servo with EtherCAT Motion Controller |
| Y-Axis Control |
Ballscrew + AC Servo with EtherCAT Motion Controller |
| Z-Axis Control |
Ballscrew + AC Servo with EtherCAT Motion Controller |
| X-Y Axis Resolution |
0.1 μm |
| Z-Axis Resolution |
0.1 μm |
Board Handling
| Max PCB Size |
TR7007D SII: 510 x 460 mm
TR7007MD SII: 660 x 610 mm. Optional: 660 x 690 mm
TR7007D SII: DL: 510x310 mm x 2 Lanes, 510x590 mm x 1 Lane
TR7007LD SII: 765 x 610 mm |
| PCB Thickness |
0.6 - 5 mm |
| Max PCB Weight |
TR7007MD SII / TR7007D SII (DL): 3 kg. Optional: 5 kg
TR7007LD SII: 3 kg. Optional: 5 kg / 12 kg |
| Top Clearance |
TR7007D SII (DL): 25 mm, TR7007MD SII / TR7007LD SII: 50 mm |
| Bottom Clearance |
40 mm |
| Edge Clearance |
3 mm. Optional: 4 mm / 5 mm |
| Conveyor Height |
880 – 920 mm. Optional: 940-965 mm
* SMEMA Compatible
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Inspection Functions
| Defects |
Insufficient Paste
Excessive Paste
Shape Deformity
Missing Paste & Bridging |
| Measurement |
Height
Area
Volume
Offset |
Dimensions
| WxDxH |
TR7007D SII: 1000 x 1480 x 1710 mm
TR7007MD SII: 1250 x 1740 x 1710 mm
TR7007D SII DL: 1000 x 1750 x 1710 mm
TR7007LD SII: 1365 x 1720 x 1710 mm
Note: not including signal tower |
| Weight |
TR7007D SII: 795 kg
TR7007MD SII: 992 kg
TR7007D SII DL: 840 kg
TR7007LD SII: 1025 kg |
Optical System
| Imaging Method |
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| Top Camera |
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| Angle Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Max. 3D Range |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor |
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Imaging System
| Camera |
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| X-ray Source |
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| Imaging Resolution |
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| Inspection Method |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Dimensions
| WxDxH |
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| Weight |
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| Power Requirement |
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