3D Solder Paste Inspection (SPI)
INTRODUCTION
The TR7900Q SII is built on a 2.5 μm high-resolution platform with 25 MP imaging technology for the Semiconductor & Advanced Packaging Industry. AI-powered algorithms and metrology capabilities enhance the Smart 3D AOI solution's effectiveness. The 3D SEMI AOI fully integrates with the loader/unloader module to ease the handling of strips and magazines. The Stop-and-Go 3D AOI can inspect die bonding, ball bonding, ribbon bond, wedge bond, SiP, underfill, SMD, bumps, and solder joints. The Smart Factory AOI solution can inspect up to 15 μm (0.6 mil) wire diameters.
• Advanced Package Defect Detection for Wire Bonding and Die Bonding
• 2.5 μm High-Resolution 3D AOI with Metrology-grade* measurements capabilities
• Built-in Loader and Unloader for Magazine handling
• Powered by AI Algorithms for Wire Detection*
• Inspection of Au, Al, Ag, and Cu Wires down to 15 μm dimensions
• Bond Inspection: ball bond, wedge bond, and ribbon bond
• Shortwave Infrared (SWIR) Lighting to detect inner cracks and chipping*.
• Clean Room Class 1000 - ISO Class 6 (ISO 14644-1)
*Optional Modules
Optical System
Imaging Method
Stop-and-Go Imaging
Top Camera
25 Mpix
Imaging Resolution
2.5 µm
Lighting
Multi-phase True Color LED
3D Technology
Quad Digital Fringe Projectors
Max. 3D Height Range
15 mm
Motion Table & Control
X Axis Control
Ball Screw + AC Servo Motor or Linear Motor
Y Axis Control
Dual Ball Screw + AC Servo Motor or Dual Linear Motor (Optional)
Z Axis Control
Ball Screw + AC Servo Motor (Reducer Optional)
X-Y Axis Resolution
0.1 µm
Board Handling
Max. Stack Magazine Qty.
3 Magazines (based on Magazine width 125 mm)
Magazine Dimension
Width: 50 - 175 mm
Length: 120 - 320 mm
Height: 80 - 150 mm
Strip Dimension
Width * : 35 - 150 mm
Length: 100 - 285 mm
Thickness: 0.1 - 1.5 mm
* When the strip width is between 35-54 mm, will require a special design.
Max. Strip Weight
0.5 kg
Strip Carrier / Fixing
Belt Conveyor
Top Clearance
7 mm
Bottom Clearance
10 mm
Edge Clearance
3 mm
Inspection Functions
Die Bonding
Missing
Orientation
Rotation
Shift
Tilted
Chipping
Crack
Scratch
Foreign Material
Bond line thickness
Epoxy on Die
Epoxy Coverage
Epoxy Height
Wire Bonding
Broken
Short
Sweep/Sink
Missing
Sway
Collapse
Loop Height
Sagged Wire
Cross Wire Gap
Wire Tracing
Ball Bond Diameter
Ball Placement
Stitch Width
Stitch Coverage over Ball
Ball-off Pad
Ball touch Pad Distance
Clubbed Ball
Ball Thickness
Lifted Ball
Low Landing
Bond on Contamination
Foreign Material
Bonding Area/Pad
Copper Protrusion
Crack
Chipping
Exposed Copper
Exposed Nickel
Target Material
Scratches or Brush Marks
Oxidation
Foreign Material
Dimensions
WxDxH
990 x 1495 x 1700 mm (Without Auto Load/Unload Module)
2065 x 1490 x 1700 mm (With Auto Load/Unload Module)
Note: not including signal tower, signal tower height 515 mm
Weight
823 kg. With Auto Load/Unload Module: 989.5 kg
VIDEO
Optical System
Imaging Method
Camera
Imaging Resolution
Lighting
3D Technology
Field of View
Inspection Performance
Imaging Speed
Height Resolution
Max. Solder Height
Motion Table & Control
X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Z-Axis Resolution
Board Handling
Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height
Optical System
Imaging Method
Top Camera
Angle Camera
Imaging Resolution
Lighting
3D Technology
Max. 3D Range
Motion Table & Control
X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Board Handling
Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor
Imaging System
Camera
X-ray Source
Imaging Resolution
Inspection Method
Motion Table & Control
X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Board Handling
Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height
Dimensions
WxDxH
Weight
Power Requirement