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Solutions

Semiconductor Inspection (SEMI)

TR7900Q SII

INTRODUCTION

The TR7900Q SII is built on a 2.5 μm high-resolution platform with 25 MP imaging technology for the Semiconductor & Advanced Packaging Industry. AI-powered algorithms and metrology capabilities enhance the Smart 3D AOI solution's effectiveness. The 3D SEMI AOI fully integrates with the loader/unloader module to ease the handling of strips and magazines. The Stop-and-Go 3D AOI can inspect die bonding, ball bonding, ribbon bond, wedge bond, SiP, underfill, SMD, bumps, and solder joints. The Smart Factory AOI solution can inspect up to 15 μm (0.6 mil) wire diameters.


• Advanced Package Defect Detection for Wire Bonding and Die Bonding
• 2.5 μm High-Resolution 3D AOI with Metrology-grade* measurements capabilities
• Built-in Loader and Unloader for Magazine handling
• Powered by AI Algorithms for Wire Detection*
• Inspection of Au, Al, Ag, and Cu Wires down to 15 μm dimensions
• Bond Inspection: ball bond, wedge bond, and ribbon bond
• Shortwave Infrared (SWIR) Lighting to detect inner cracks and chipping*.
• Clean Room Class 1000 - ISO Class 6 (ISO 14644-1)

*Optional Modules