The TR7600 SV series is the newly released line scan 3D AXI, offering up to a 20% performance improvement compared to the award-winning TR7600 SIII series. Powered by AI algorithms, this high-speed 3D AXI can precisely detect void defects. With a high resolution of 7 µm, the TR7600 SV series delivers high-yield-rate inspection.

The robust platform is capable of fast image reconstruction and defect detection in BGAs, Barrel fill, Capacitors, Chips, Components Under RF shields, CSPs, DIMM Connectors, Flip-Chips, Ground Pads, Gullwing, Heat sinks, J-Leads , LED Chips, LGAs, Paladin Connector, Resistor, RNET, SiP, SMT Connectors, SOIC, SOT, Thermal Pad, QFNs, QFP and THTs.