We use cookies to improve your user experience and for web traffic statistics purposes. By continuing to use this website, you agree to our use of cookies. Our Privacy & Cookie Policy contains more information on such use and explains how to disable cookies.
The currently displayed page is not available in the selected language. Select Yes to go to =A= version, No to go to =B= version, or click the X symbol to stay on this page.
  • =A=
  • =B=
About Us Solutions News Customer Service Investor Relations


Automated X-ray Inspection (AXI)



The TR7600 SV series is the newly released line scan 3D AXI, offering up to a 20% performance improvement compared to the award-winning TR7600 SIII series. Powered by AI algorithms, this high-speed 3D AXI can precisely detect void defects. With a high resolution of 7 µm, the TR7600 SV series delivers high-yield-rate inspection.

The robust platform is capable of fast image reconstruction and defect detection in BGAs, Barrel fill, Capacitors, Chips, Components Under RF shields, CSPs, DIMM Connectors, Flip-Chips, Ground Pads, Gullwing, Heat sinks, J-Leads , LED Chips, LGAs, Paladin Connector, Resistor, RNET, SiP, SMT Connectors, SOIC, SOT, Thermal Pad, QFNs, QFP and THTs.
• 7 µm High Performance Inspection, 20% Performance Improvement compared to previous model
• New motion controller, EtherCAT, for real-time measurements and ease of maintenance
• AI-Powered Inspection algorithms for precise defect detection
• Smart Factory Ready for Easy MES Connectivity
• Worldwide Technical Support Services