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TR8100LV
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TR8100LV
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INTRODUCTION
Designed for testing large and complex PCBAs, the TR8100LV is TRI's top-of-the-line board test system targeting the low-voltage testing market. TR8100LV's vacuum system ensures full pin contact and with up to 3,584 pin digital MUX-free architecture, the system allows for faster and simpler testing of large pin-count devices and fast program development. Included *TRI ToggleScan® and VregTest® technology combine Boundary Scan with solutions for limited test access boards. *"ToggleScan®" and " VregTest®" are registered trademarks of Test Research, Inc.
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• Digital 1:1 driver/receiver per pin architecture design
• High fault coverage test solution with vacuum fixture
• Low voltage device testing and rapid test speed
• Friendly UI with fast and easy program development
Tester Specifications
Analog/hybrid test points |
TR8100LV: 3584
TR8100LLV: 5632 |
Operating System |
Microsoft® Windows compatible PC, Windows 10 |
Fixture Type |
Offline press or vacuum type fixture |
Standard Testing Components
Analog Test Hardware |
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6-wire measurement switching matrix
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Programmable AC/DC/DC High voltage and current sources
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AC/DC voltage, DC current measurement, frequency
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Component R/L/C measurement
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Synthesized Arbitrary Waveform Generator
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TestJet vectorless open circuit detection
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Digital Testing |
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Non-multiplexing 1:1 per pin architecture with independent per-pin level setting
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DUT power supplies: 5 V@5 A, 3.3 V@5 A, 12 V@5A, 0.2~20 V@3 A and -3~-20 V@3 A
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On-board Flash, EEPROM, MAC programming
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Optional Components
Analog Hardware |
Fixture Conversion Kits for Teradyne, GenRad |
Digital Testing |
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Programmable DUT power supplies: 75 V / 8 A, 200W maximum output power
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Includes BScan Chain Test, BScan Cluster Test, BScan Virtual Nails Test, BScan Virtual Chain Test and IEEE1149.6 Test
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Yield Management System |
YMS 4.0 |
Dimensions
WxDxH |
TR8100LV: 1150 x 850 x 800 mm
TR8100LLV: 1550 x 850 x 800 mm |
Weight |
TR8100LV: 390 kg
TR8100LLV: 450 kg |
Optical System
Imaging Method |
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Camera |
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Imaging Resolution |
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Lighting |
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3D Technology |
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Field of View |
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Inspection Performance
Imaging Speed |
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Height Resolution |
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Max. Solder Height |
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Motion Table & Control
X-Axis Control |
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Y-Axis Control |
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Z-Axis Control |
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X-Y Axis Resolution |
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Z-Axis Resolution |
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Board Handling
Max PCB Size |
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PCB Thickness |
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Max PCB Weight |
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Top Clearance |
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Bottom Clearance |
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Edge Clearance |
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Conveyor Height |
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Optical System
Imaging Method |
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Top Camera |
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Angle Camera |
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Imaging Resolution |
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Lighting |
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3D Technology |
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Max. 3D Range |
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Motion Table & Control
X-Axis Control |
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Y-Axis Control |
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Z-Axis Control |
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X-Y Axis Resolution |
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Board Handling
Max PCB Size |
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PCB Thickness |
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Max PCB Weight |
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Top Clearance |
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Bottom Clearance |
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Edge Clearance |
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Conveyor |
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Imaging System
Camera |
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X-ray Source |
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Imaging Resolution |
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Inspection Method |
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Motion Table & Control
X-Axis Control |
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Y-Axis Control |
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Z-Axis Control |
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X-Y Axis Resolution |
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Board Handling
Max PCB Size |
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PCB Thickness |
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Max PCB Weight |
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Top Clearance |
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Bottom Clearance |
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Edge Clearance |
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Conveyor Height |
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Dimensions
WxDxH |
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Weight |
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Power Requirement |
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