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Automated Optical Inspection (AOI)
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TR7700 SIII
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TR7700 SIII Plus
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INTRODUCTION
TR7700 SIII Plus is the newest generation of TRI's AOI solutions, delivering precise multi-phase inspection at full speed. By combining an ultra-fast camera, intelligent auto conveyor, and new GUI, the TR7700 SIII Plus offers a powerful and easy to use AOI solution with fast programming, optimized board loading, production line integration and support for offline programming. TRI's new color algorithm combined with multiple lighting phases increase defect coverage and help deliver highly accurate inspection results with a minimum of false calls.
• High precision full speed multi-phase AOI
• New GUI for easy programming with offline editing
• Intelligent auto conveyor for reduced load times
• New color algorithm delivers high accuracy and minimizes false calls
Optical System
| Imaging Method |
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| Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Field of View |
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Inspection Performance
| Imaging Speed |
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| Height Resolution |
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| Max. Solder Height |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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| Z-Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Optical System
| Imaging Method |
Dynamic Imaging |
| Top Camera |
4 or 9 or 12 Mpix high speed color camera |
| Angle Camera |
N/A |
| Imaging Resolution |
5.5 µm, 6 µm, 10 µm, 15 µm (factory setting)
Note: 4 MP camera configuration supports 10/15 μm, 9 MP configuration supports 10 μm, 12 MP configuration supports 6 μm. |
| Lighting |
Multi-phase RGB+W LED |
| 3D Technology |
Single/Dual 3D laser sensors (optional) |
| Max. 3D Range |
@5.5 μm: 2 mm
@6 μm: 2 mm
@10 μm: 4 mm
@15 μm: 20 mm
Note: Depending on board size, layout, laser type and/or laser module settings |
Inspection Performance
| Imaging Speed |
@5.5 μm 2D: 24 cm²/sec
@6 µm 2D: 30 cm²/sec
@10 µm 2D: 60 cm²/sec
@15 µm 2D: 120 cm²/sec
@5.5 µm 2D+3D (optional): 4 – 10 cm²/s
@6 µm 2D+3D (optional): 4 – 10 cm²/sec
@10 µm 2D+3D (optional): 27 – 39 cm²/sec
@15 µm 2D+3D (optional): 40 – 60 cm²/sec
Note: Depending on board size, layout, laser type and/or laser module settings
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Motion Table & Control
| X-Axis Control |
Ballscrew + AC-servo controller |
| Y-Axis Control |
Ballscrew + AC-servo controller |
| Z-Axis Control |
N/A |
| X-Y Axis Resolution |
1 µm |
Board Handling
| Max PCB Size |
TR7700 SIII Plus: 510 x 460 mm
TR7700L SIII: 660 x 610 mm
TR7700L SIII Plus: 765 x 610 mm
TR7700 SIII DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane
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| PCB Thickness |
0.6-5 mm |
| Max PCB Weight |
TR7700 SIII Plus: 3 kg
TR7700L SIII: 5 kg
TR7700L SIII Plus: 3 kg. Optional: 5 / 12 kg
TR7700 SIII DL: 3 kg |
| Top Clearance |
25 mm |
| Bottom Clearance |
40 mm |
| Edge Clearance |
TR7700 SIII Plus: 3 mm [5 mm optional]
TR7700L SIII: 5 mm
TR7700L SIII Plus: 3 mm. [4 / 5 mm optional]
TR7700 SIII DL: 3 mm [5 mm optional] |
| Conveyor |
Inline Height: 880 – 920 mm
* SMEMA Compatible
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Inspection Functions
| Component |
Missing
Tombstoning
Billboarding
Polarity
Rotation
Shift
Wrong Marking (OCV)
Defective
Upside Down
Extra Component
Foreign Material
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| Solder |
Excess Solder
Insufficient Solder
Bridging
Through-hole Pins
Lifted Lead
Golden Finger
Scratch/Contamination
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Dimensions
| WxDxH |
TR7700 SIII Plus: 1100 x 1670 x 1550 mm
TR7700L SIII: 1300 x 1635 x 1655 mm
TR7700L SIII Plus: 1365 x 1720 x 1710 mm
TR7700 SIII DL: 1100 x 1670 x 1550 mm
Note: not including signal tower, signal tower height 520 mm
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| Weight |
TR7700 SIII Plus: 1080 kg
TR7700L SIII: 1240 kg
TR7700L SIII Plus: 1005 kg
TR7700 SIII DL: 1150 kg
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Imaging System
| Camera |
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| X-ray Source |
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| Imaging Resolution |
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| Inspection Method |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Dimensions
| WxDxH |
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| Weight |
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| Power Requirement |
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