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Automated X-ray Inspection (AXI)
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INTRODUCTION
The 2.5D Inline AXI TR7600F2D Plus is built on a new mechanical platform for faster cycle time, 10% performance improvement compared to the previous model. High Resolution of 5 µm, the TR7600F2D Plus delivers full coverage inspection, ideally for inspection in the consumer electronics industry, such as mobile electronics manufacturing.
The TR7600F2D Plus can reliably detect defects in BGAs, Capacitors, Chips, WLCSP, DIMM Connectors, Flip-Chips, Ground Pads, Gullwing, Heat sinks, J-Leads, LED Chips, LGAs, Paladin Connector, Resistor, RNET, SiP, SMT Connectors, SOIC, SOT, Thermal Pad, QFNs, QFP and THTs.
• Next Generation Mechanical Design for Faster Cycle Time
• Flexible Multi-Resolution, Multi-Power in one Configuration
• New motion controller, for real-time measurements and ease of maintenance
• Improved 2D Camera for easier adjustments and less calibration
• Large Board Inspection, up to 900 mm x 520 mm
• Smart Factory Ready with MES Connectivity
Optical System
Imaging Method |
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Camera |
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Imaging Resolution |
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Lighting |
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3D Technology |
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Field of View |
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Inspection Performance
Imaging Speed |
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Height Resolution |
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Max. Solder Height |
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Motion Table & Control
X-Axis Control |
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Y-Axis Control |
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Z-Axis Control |
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X-Y Axis Resolution |
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Z-Axis Resolution |
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Board Handling
Max PCB Size |
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PCB Thickness |
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Max PCB Weight |
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Top Clearance |
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Bottom Clearance |
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Edge Clearance |
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Conveyor Height |
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Optical System
Imaging Method |
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Top Camera |
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Angle Camera |
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Imaging Resolution |
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Lighting |
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3D Technology |
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Max. 3D Range |
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Motion Table & Control
X-Axis Control |
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Y-Axis Control |
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Z-Axis Control |
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X-Y Axis Resolution |
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Board Handling
Max PCB Size |
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PCB Thickness |
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Max PCB Weight |
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Top Clearance |
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Bottom Clearance |
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Edge Clearance |
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Conveyor |
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Imaging System
Camera |
Flat Panel Detector |
X-ray Source |
60 -130 kV |
Imaging Resolution |
5 μm - 30 μm |
Inspection Method |
2D, 2.5D, Planar CT (optional) |
Motion Table & Control
X-Axis Control |
High-precision ballscrew + AC-servo controller |
Y-Axis Control |
High-precision ballscrew + AC-servo controller |
Z-Axis Control |
High-precision ballscrew + AC-servo controller |
X-Y Axis Resolution |
N/A |
Board Handling
Max PCB Size |
900 x 520 mm |
PCB Thickness |
0.5 - 7 mm |
Max PCB Weight |
12 kg |
Top Clearance |
@ 15/20/25/30 μm: 50 mm @ 10 μm: 30 mm @ 5 μm: 10 mm
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Bottom Clearance |
50 mm |
Edge Clearance |
3 mm or 5 mm |
Conveyor Height |
880 - 920 mm
* SMEMA Compatible
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Inspection Functions
Capabilities |
BGAs Capacitors Chips WLCSP DIMM Connectors Flip-Chips Ground Pads Gullwing Heat sinks J-Leads LED Chips LGAs Paladin Connector Resistor RNET SiP SMT Connectors SOIC SOT Thermal Pad QFNs QFP THTs |
Defects |
Missing Misalignment Tombstone Billboard Tantalum Polarity Rotation Insufficient/Excess Solder Bridging Open Solder Ball Void |
Dimensions
WxDxH |
1537 x 2160 x 1800 mm
Note: not including signal tower, height: 519.5 mm
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Weight |
3150 kg |
Power Requirement |
200 – 240 VAC, single phase, 50/60 Hz, 4 kVA |
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