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Solutions

3D Solder Paste Inspection (SPI)

TR7007 SII Ultra

INTRODUCTION

The TR7007 SII Ultra performs at an industry-leading speed of up to 180 cm2/sec. The TR7007 SII Ultra is built on an enhanced mechanical platform to guarantee stability, accuracy, and precision during the inspection. The 3D SPI is an Industry 4.0 Ready Solution supporting the upcoming and innovative protocols such as IPC Connected Factory Exchange (CFX) and IPC Hermes 9852 standard.
•  Industry-leading inspection speed up to 180 cm2/sec
•  Ready to Inspect in Minutes with TRI's Smart Inspection Library
•  Closed Loop Ready: Feedback and Feedforward Capabilities
•  Smart Factory solution with Real-time SPC Trends