We use cookies to improve your user experience and for web traffic statistics purposes. By continuing to use this website, you agree to our use of cookies. Our Privacy & Cookie Policy contains more information on such use and explains how to disable cookies.
The currently displayed page is not available in the selected language. Select Yes to go to =A= version, No to go to =B= version, or click the X symbol to stay on this page.
  • =A=
  • =B=
About Us Solutions News Customer Service Investor Relations


3D Solder Paste Inspection (SPI)



The TR7007 SIII performs at an industry-leading speed of up to 170 cm2/sec. The TR7007 SIII is built on an enhanced mechanical platform to guarantee stability, accuracy, and precision during the inspection. The 3D SPI is an Industry 4.0 Ready Solution supporting the upcoming and innovative protocols such as IPC Connected Factory Exchange (CFX) and IPC Hermes 9852 standard.

•  Industry-leading inspection speed up to 170 cm2/sec
•  Ready to Inspect in Minutes with TRI's Smart Programming
•  Multiple Industry Applications: Telecom, Consumer electronics and more
•  Closed Loop Ready: Feedback and Feedforward Capabilities
•  Smart Factory solution with Real-time SPC Trends