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TR5001V SII SERIES
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TR5001DV_SII
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INTRODUCTION
Top-of-the-line multi-core parallel vacuum ICT+FCT solution. TR5001V SII Series offers breakthrough performance with up to 4 independent cores for high throughput. Includes durable Quick Disconnect Interface together with built-in auto-calibration and self-diagnostics ensure long-term testing reliability. TR5001V SII Series is powered by TRI's flow-based Smart Programming Software for ease of use.
• Multi-Core Parallel Test
• Reliable Vacuum Fixture Testing
• Non-Multiplexing 1:1 per Pin Architecture
• Scalable MDA to ICT and Functional Test
• High Accuracy and High Throughput
• Durable Quick Disconnection Interface
Tester Specifications
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Analog/hybrid test points |
TR5001QV SII: 4096
TR5001DV SII: 3328
TR5001V SII: 3456 |
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Operating System |
Microsoft® Windows compatible PC with USB, Windows 10 |
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Fixture Type |
Vacuum fixture with Quick Disconnection InterfaceStandard Testing Components |
Standard Testing Components
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Analog Test Hardware |
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6-wire measurement switching matrix
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Programmable AC/DC/DC High voltage and current sources
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AC/DC voltage, DC current measurement
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Component R/L/C measurement
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Optional Components
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Analog Hardware |
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TestJet vectorless open circuit detection
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Arbitrary Waveform Generator
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Digital Testing |
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Non-multiplexing 1:1 per pin architecture with independent per-pin level setting
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Serial Test Controller (STC) Programming
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DUT power supplies: 5 V@3 A, 3.3 V@3 A, 12 V@3A, -12 V@1 A and 24 V@3 A
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DPS Programmable DUT Power supply :
(1) DPS3514: 30Vmax/5Amax/100Wmax per channel /4CH per DPS
(2) DPS3122: 30Vmax/10Amax/200Wmax per channel /2CH per DPS
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Programmable DUT power supplies: 75 V / 8 A max, 200W maximum output power
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Includes BScan Chain Test, BScan Cluster Test, BScan Virtual Nails Test, BScan Virtual Chain Test and IEEE1149.6 Test
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Up to 8 High Speed Serial Ports, On-board Flash, EEPROM, MAC programming
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Yield Management System |
YMS 4.0 |
Dimensions
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WxDxH |
900 x 1080 x 1270 mm
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Weight |
TR5001QV SII: 370 kg
TR5001DV SII: 350 kg
TR5001V SII: 350 kg |
Optical System
| Imaging Method |
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| Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Field of View |
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Inspection Performance
| Imaging Speed |
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| Height Resolution |
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| Max. Solder Height |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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| Z-Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Optical System
| Imaging Method |
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| Top Camera |
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| Angle Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Max. 3D Range |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor |
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Imaging System
| Camera |
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| X-ray Source |
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| Imaging Resolution |
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| Inspection Method |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Dimensions
| WxDxH |
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| Weight |
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| Power Requirement |
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