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3D Solder Paste Inspection (SPI)



The TR7007D SII is a cutting-edge 3D SPI system designed to enhance your production processes. With its high-speed platform, the 3D SPI delivers up to 50% faster inspection compared to previous models, ensuring optimal efficiency. Experience improved accuracy and stability, allowing for precise solder measurements and minimizing false calls. Equipped with a wide spectrum light system and coaxial lighting*, the TR7007Q SII enhances contrast and detection rates, enabling you to capture intricate details with exceptional clarity. The 3D SPI is an Industry 4.0 Ready Solution supporting the upcoming and innovative protocols such as IPC Connected Factory Exchange (CFX) and IPC Hermes 9852 standard. (*Optional)

• Wide Spectrum Light for Enhanced Contrast and Detection Rate
• Improved Accuracy and Stability for Precise Solder Measurements
• New motion controller, EtherCAT, for real-time measurements
• 100% Shadow-free Dual Digital Fringe projectors
• SmartWarp Compensation Eliminates Local PCB Deformation
• Smart Factory solution with Real-time SPC Trends
• Closed Loop Ready: Feedback and Feed-forward Capabilities