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Automated Optical Inspection (AOI)



The TR7700QM SII is built on a high accuracy platform with 5.5 µm high resolution 12 MP imaging technology for the Semiconductor & Packaging industry. The Stop-and-Go 3D AOI is able to inspect wire bonds, die bonds, SMD, bumps, and solder joints. The Smart 3D AOI solution's accuracy is enhanced with metrology capabilities and flexible inspection algorithms.
• Semiconductor and Packaging technology Inspection.
• 5.5 μm Resolution for Ultra-High Precision Metrology-grade Inspection
• Ready to Inspect in Minutes with TRI's Smart Programming
• Multiple 3D Technologies for Full coverage Inspection