Solutions

3D Solder Paste Inspection (SPI)

TR7007 SIII

INTRODUCTION

The TR7007 SIII performs at an industry-leading speed of up to 200 cm²/sec. The TR7007 SIII is built on an enhanced mechanical platform to guarantee stability, accuracy, and precision during the inspection. The 3D SPI is an Industry 4.0 Ready Solution supporting the upcoming and innovative protocols such as IPC Connected Factory Exchange (CFX) and IPC Hermes 9852 standard.

• Industry-leading inspection speed up to 200 cm²/sec
• Ready to Inspect in Minutes with TRI's Smart Programming
• Multiple Industry Applications: Telecom, Consumer electronics and more
• Closed Loop Ready: Feedback and Feedforward Capabilities
• Smart Factory solution with Real-time SPC Trends

Optical System

Imaging Method	Dynamic Imaging
Camera	4 Mpix
Imaging Resolution	10 μm, 15 µm (factory setting)
Lighting	Wide Spectrum 2D Lights (RGB+W), Coaxial Lighting
3D Technology	2-way Fringe Pattern
Field of View	4 Mpix@ 10 µm: 20 x 20 mm 4 Mpix@ 15 µm: 30 x 30 mm

Inspection Performance

Imaging Speed	4 Mpix@ 10 µm: 90 cm²/sec 4 Mpix@ 15 µm: 200 cm²/sec
Height Resolution	0.4 µm
Max. Solder Height	@ 10 µm: 400 µm @ 15 µm: 385 µm

Motion Table & Control

X-Axis Control	Linear motor + Linear Scale + EtherCAT Servo
Y-Axis Control	AC motor with ball screw + EtherCAT Servo
Z-Axis Control	AC motor with ball screw + EtherCAT Servo
X-Y Axis Resolution	0.5 µm
Z-Axis Resolution	1 µm

Board Handling

Max PCB Size	TR7007 SIII: 510 x 460 mm TR7007 SIII DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane
PCB Thickness	0.6-5 mm
Max PCB Weight	3 kg
Top Clearance	50 mm
Bottom Clearance	40 mm
Edge Clearance	3 mm
Conveyor Height	880 – 920 mm * SMEMA Compatible

Inspection Functions

Defects	Insufficient Paste Excessive Paste Shape Deformity Missing Paste & Bridging
Measurement	Height Area Volume Offset

Dimensions

WxDxH	TR7007 SIII: 1100 x 1480 x 1600 TR7007 SIII DL: 1100 x 1705 x 1600 mm Note: not including signal tower, signal tower height 512 mm
Weight	TR7007 SIII: 740 kg TR7007 SIII DL: 925 kg

Optical System

Imaging Method
Top Camera
Angle Camera
Imaging Resolution
Lighting
3D Technology
Max. 3D Range

Inspection Performance

Imaging Speed

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor

Inspection Functions

Component
Solder

Dimensions

WxDxH
Weight

Imaging System

Camera
X-ray Source
Imaging Resolution
Inspection Method

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Capabilities
Defects

Dimensions

WxDxH
Weight
Power Requirement

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