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Automated X-ray Inspection (AXI)
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INTRODUCTION
The TR7600F3D SII Plus is the latest 3 µm high-resolution 3D AXI, with CT capabilities, for High-Reliability industries, especially for the Advanced Packaging Industry and others. The 3D AXI is powered by state-of-the-art AI inspection algorithms for Void and open defect detection. Equipped with the next-generation 110 kV X-ray source and high-resolution detectors, it captures even the minutest defects, ensuring that you meet the highest standards of quality and reliability.
The TR7600F3D SII Plus can reliably detect defects in BGAs, Backdrill, Barrel fill, Capacitors, Resistor, Chips, Components Under RF shields, WLCSP, DIMM Connectors, Flip-Chips, Ground Pads, Gullwing, Heat sinks, J-Leads, LED Chips, LGAs, Paladin Connector, RNET, SiP, SMT Connectors, SOIC, SOT, Thermal Pad, QFNs, QFP and THTs.
• 3 µm High Precision 3D CT X-ray for High Reliability Electronics Manufacturing Industries
• AI-powered inspection algorithms for precise defect detection
• Large Board Capabilities, Up to 1000 x 660 mm
• Smart Board Warpage Control
• 2D Camera for Automotive Industry: barcode, fiducial, and bare board marking reading.
• Smart Factory Ready with Easy MES Connectivity
• Ease of Maintenance and Radiation Safe Design
• Applications: Advanced Packaging, Automotive, Aerospace, Medical
Imaging System
Camera |
Flat Panel Detector |
X-ray Source |
60 - 110 kV |
Imaging Resolution |
3 μm - 30 μm |
Inspection Method |
2D, 2.5D, 3D Slicing, Planar CT (Optional) |
Motion Table & Control
X Axis Control |
High-precision ballscrew + AC-servo controller |
Y Axis Control |
High-precision ballscrew + AC-servo controller |
Z Axis Control |
High-precision ballscrew + AC-servo controller |
Board Handling
Max. PCB Size |
TR7600F3D SII Plus: 780 x 260 mm
TR7600F3D LL SII Plus: 1000 x 660 mm
Note: The Max. PCB Size will vary depending on the angle of incidence |
PCB Thickness |
TR7600F3D SII Plus: 0.6 - 7 mm
TR7600F3D LL SII Plus: 0.4 - 7 mm |
Max. PCB Weight |
12 kg |
Top Clearance |
@ 20/25/30 μm: 50 mm
@ 15 μm: 30 mm
@ 10 μm: 20 mm
@ 5 μm: 8 mm
@ 3 μm: 3 mm
Note: TR7600F3D LL SII Plus is only available for 3 μm - 15 μm |
Bottom Clearance |
@ 25/30 μm: 50 mm
@ 15/20/25 μm: 55 mm
@ 10 μm: 65 mm
@ 3/5 μm: 70 mm
Note: TR7600F3D LL SII Plus is only available for 3 μm - 15 μm |
Edge Clearance |
3 mm or 5 mm |
Conveyor |
880 – 920 mm
* SMEMA Compatible |
Inspection Functions
Capabilities |
BGAs
Backdrill
Barrel fill
Capacitors
Resistor
Chips
Components Under RF shields
WLCSP
DIMM Connectors
Flip-Chips
Ground Pads
Gullwing
Heat sinks
J-Leads
LED Chips
LGAs
Paladin Connector
RNET
SiP
SMT Connectors
SOIC
SOT
Thermal Pad
QFNs
QFP
THTs |
Defects |
Missing
Misalignment
Tombstone
Billboard
Tantalum Polarity
Rotation
Foreign Material
Insufficient/Excess Solder
Bridging
Open
Solder Ball
Non-Wetting
Void
Lifted Lead |
Dimensions
WxDxH |
TR7600F3D SII Plus: 1470 x 1971 x 1975 mm
TR7600F3D LL SII Plus: 1730 x 2300 x 1975 mm
Note: not including signal tower, height: 519 mm |
Weight |
TR7600F3D SII Plus: 3850 kg
TR7600F3D LL SII Plus: 4850 kg |
Power Requirement |
200 - 240 VAC single phase, 50/60 Hz, 4 kVA |
Optical System
Imaging Method |
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Camera |
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Imaging Resolution |
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Lighting |
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3D Technology |
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Field of View |
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Inspection Performance
Imaging Speed |
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Height Resolution |
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Max. Solder Height |
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Motion Table & Control
X-Axis Control |
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Y-Axis Control |
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Z-Axis Control |
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X-Y Axis Resolution |
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Z-Axis Resolution |
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Board Handling
Max PCB Size |
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PCB Thickness |
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Max PCB Weight |
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Top Clearance |
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Bottom Clearance |
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Edge Clearance |
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Conveyor Height |
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Optical System
Imaging Method |
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Top Camera |
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Angle Camera |
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Imaging Resolution |
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Lighting |
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3D Technology |
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Max. 3D Range |
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Motion Table & Control
X-Axis Control |
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Y-Axis Control |
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Z-Axis Control |
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X-Y Axis Resolution |
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Board Handling
Max PCB Size |
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PCB Thickness |
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Max PCB Weight |
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Top Clearance |
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Bottom Clearance |
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Edge Clearance |
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Conveyor |
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Imaging System
Camera |
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X-ray Source |
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Imaging Resolution |
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Inspection Method |
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Motion Table & Control
X-Axis Control |
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Y-Axis Control |
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Z-Axis Control |
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X-Y Axis Resolution |
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Board Handling
Max PCB Size |
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PCB Thickness |
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Max PCB Weight |
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Top Clearance |
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Bottom Clearance |
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Edge Clearance |
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Conveyor Height |
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Dimensions
WxDxH |
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Weight |
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Power Requirement |
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