|
|
Automated X-ray Inspection (AXI)
|
INTRODUCTION
The TR7600F2D QL is built on a new mechanical platform for the inspection of large boards, up to 2100 x 510 mm. Multi
High-Resolution inspections ranging from 5 – 30 µm. The AXI is also equipped with a specialized 2D Camera that supports automotive applications like barcode reading and fiducial detection.
The TR7600F2D QL can reliably detect defects in BGAs, Capacitors, Chips, WLCSP, DIMM Connectors, Flip-Chips, Ground Pads, Gullwing, Heat sinks, J-Leads, LED Chips, LGAs, Paladin Connector, Resistor, RNET, SiP, SMT Connectors, SOIC, SOT, Thermal Pad, QFNs, QFP and THTs.
• Large Board Size Inspection, Up to 2100 x 510 mm
• Flexible Multi-Resolution Platform: 5 – 30 µm
• Inline fine-tuning without interrupting production
• AI-Powered Inspection algorithms for precise defect detection
• 2D Camera for barcode reading, fiducial detection, and bare board marking in the Automotive sector
• Smart Factory Ready for Easy MES Connectivity
• Applications: Server Board, LED Boards, Automotive ECU and more
Optical System
| Imaging Method |
|
| Camera |
|
| Imaging Resolution |
|
| Lighting |
|
| 3D Technology |
|
| Field of View |
|
Inspection Performance
| Imaging Speed |
|
| Height Resolution |
|
| Max. Solder Height |
|
Motion Table & Control
| X-Axis Control |
|
| Y-Axis Control |
|
| Z-Axis Control |
|
| X-Y Axis Resolution |
|
| Z-Axis Resolution |
|
Board Handling
| Max PCB Size |
|
| PCB Thickness |
|
| Max PCB Weight |
|
| Top Clearance |
|
| Bottom Clearance |
|
| Edge Clearance |
|
| Conveyor Height |
|
Optical System
| Imaging Method |
|
| Top Camera |
|
| Angle Camera |
|
| Imaging Resolution |
|
| Lighting |
|
| 3D Technology |
|
| Max. 3D Range |
|
Motion Table & Control
| X-Axis Control |
|
| Y-Axis Control |
|
| Z-Axis Control |
|
| X-Y Axis Resolution |
|
Board Handling
| Max PCB Size |
|
| PCB Thickness |
|
| Max PCB Weight |
|
| Top Clearance |
|
| Bottom Clearance |
|
| Edge Clearance |
|
| Conveyor |
|
Imaging System
| Camera |
Flat Panel Detector |
| X-ray Source |
60 - 130 kV |
| Imaging Resolution |
5 μm - 25 μm |
| Inspection Method |
2D |
Motion Table & Control
| X-Axis Control |
High-Precision Ballscrew + AC-Servo Controller |
| Y-Axis Control |
High-Precision Ballscrew + AC-Servo Controller |
| Z-Axis Control |
High-Precision Ballscrew + AC-Servo Controller |
| X-Y Axis Resolution |
N/A |
Board Handling
| Max PCB Size |
2100 x 510 mm |
| PCB Thickness |
0.6 - 7 mm |
| Max PCB Weight |
12 kg |
| Top Clearance |
@ 20/25 μm: 50 mm
@ 15 μm: 40 mm
@ 10 μm: 25 mm
@ 5 μm: 3 mm |
| Bottom Clearance |
70 mm |
| Edge Clearance |
3 mm or 5 mm |
| Conveyor Height |
880 - 920 mm
* SMEMA Compatible
|
Inspection Functions
| Capabilities |
BGAs
Capacitors
Chips
Ground Pads
Gullwing
Resistor
RNET
SMT Connectors
SOIC
SOT
Thermal Pad
QFNs
QFP |
| Defects |
Missing
Misalignment
Tombstone
Billboard
Tantalum Polarity
Rotation
Insufficient/Excess Solder
Bridging
Solder Ball
Void |
Dimensions
| WxDxH |
3600 x 2000 x 1940 mm
Note: not including signal tower, height: 520 mm |
| Weight |
5800 kg |
| Power Requirement |
200 – 240 VLL , Three phase 4 W, 50 / 60Hz, 7.0 kVA |
|
Search
Members Area
