We use cookies to improve your user experience and for web traffic statistics purposes. By continuing to use this website, you agree to our use of cookies. Our Privacy & Cookie Policy contains more information on such use and explains how to disable cookies.
The currently displayed page is not available in the selected language. Select Yes to go to =A= version, No to go to =B= version, or click the X symbol to stay on this page.
  • =A=
  • =B=
About Us Solutions News Customer Service Investor Relations

Solutions

3D Solder Paste Inspection (SPI)

TR7007 SII

TR7007 SII
  • TR7007 SII
TR7007 SII

INTRODUCTION

Offering inspection speeds of up to 180 cm2/sec, the TR7007 SII is the fastest solder paste inspection system in the industry. This highly accurate inline shadow-free solder paste inspection solution offers full 3D inspection at resolutions of 15 µm or 10 µm. Built on a high precision linear motor platform, the system’s hallmark features include closed loop function, enhanced 2D imaging, auto-warp compensation and fringe pattern technology. Increase capacity without sacrificing additional space with an available dual-lane configuration.
  • • World’s fastest inspection speed up to 180 cm2/sec @ 15 µm
    • Shadow free Fringe Pattern lighting technology
    • Optical resolution 10 µm or 15 µm
    • Linear motor X-Y table for vibration free accurate inspection