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INTRODUCTION
专为半导体、先进封装、汽车、航太及医疗等高可靠性产业设计的 TR7600 SIII Plus，是 TRI 的高产能 3D SEMI AXI 机种。该设备支援高达 800 x 350 mm、重达 12 kg 的大尺寸载板，并具备 2 µm - 20 µm 多重解析度检测能力，可确保快速且准确地检测 C4 凸块、系统级封装（SiP）与铜柱等元件；此外，在 AI 气泡检测与 AI 维修站等演算法的驱动下，更能进而大幅提升缺陷检测率。
• 高产能 3D SEMI AXI，专为满足 OSAT 的产能需求而优化
• AI 驱动检测演算法，可实现精确的缺陷检测
• C4 凸块（70 µm 至 140 µm）与铜柱检测能力
• 弹性多重解析度平台：2 – 20 µm 生产配置
• 线上微调，无需中断生产
• 可检测高达 800 x 350 mm、重达 12 kg 的大尺寸载板
• 支援智慧工厂，具备 MES 串接功能
• 应用领域：先进封装、汽车、航太、医疗
Imaging System
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Camera |
Ultra-High Speed Line-Scan CCD Cameras |
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X-ray Source |
60 - 110 kV |
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Imaging Resolution |
2 μm - 20 μm |
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Inspection Method |
2D, 2.5D, 3D Slicing, Planar CT (Optional) |
Motion Table & Control
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X Axis Control |
High-precision ballscrew + AC-servo controller |
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Y Axis Control |
High-precision ballscrew + AC-servo controller |
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Z Axis Control |
High-precision ballscrew + AC-servo controller |
Board Handling
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Max. PCB Size |
2 μm - 3 μm: 245 x 100 mm
7 μm - 20 μm: 800 x 350 mm |
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PCB Thickness |
0.6 - 7 mm (Optional: 0.4 mm, Max. PCB Weight: 3 kg) |
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Max. PCB Weight |
12 kg |
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Top Clearance |
@ 20 μm: 50 mm
@ 15 μm: 45 mm
@ 10 μm: 29 mm
@ 7 μm: 19 mm
@ 3 μm: 5 mm
@ 2 μm: 3 mm
Note: Calibration is required for non-standard resolutions. |
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Bottom Clearance |
70 mm |
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Edge Clearance |
3 mm or 5 mm |
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Conveyor |
880 – 920 mm. (Optional: 940 - 965 mm)
* SMEMA Compatible |
Inspection Functions
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Capabilities |
BGAs
Backdrill
Barrel fill
Capacitors
Resistor
Chips
Components Under RF shields
WLCSP
DIMM Connectors
Flip-Chips
Ground Pads
Gullwing
Heat sinks
J-Leads
LED Chips
LGAs
Paladin Connector
RNET
SiP
SMT Connectors
SOIC
SOT
Thermal Pad
QFNs
QFP
THTs |
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Defects |
Missing
Misalignment
Tombstone
Billboard
Tantalum Polarity
Rotation
Foreign Material
Insufficient/Excess Solder
Bridging
Open
Solder Ball
Non-Wetting
Void
Lifted Lead |
Dimensions
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WxDxH |
1470 x 1971 x 1975 mm
Note: not including signal tower, height: 519 mm |
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Weight |
3870 kg |
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Power Requirement |
200 - 240 VAC single phase, 50/60 Hz, 4 kVA |
Optical System
| Imaging Method |
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| Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Field of View |
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Inspection Performance
| Imaging Speed |
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| Height Resolution |
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| Max. Solder Height |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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| Z-Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Optical System
| Imaging Method |
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| Top Camera |
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| Angle Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Max. 3D Range |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor |
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Imaging System
| Camera |
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| X-ray Source |
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| Imaging Resolution |
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| Inspection Method |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Dimensions
| WxDxH |
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| Weight |
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| Power Requirement |
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