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INTRODUCTION
TR7950Q SII 系列是一款具备高度模组化的晶圆检测与细微量测计量平台，利用 AI 驱动演算法，在先进半导体制造中实现生产良率的最大化。这款高度模组化的系统配备了选配的 SWIR（短波红外线）模组，专为侦测隐蔽的内部裂痕及次表面缺陷而设计，这些缺陷是标准可见光感测器所无法察觉的。适用于检测与计量：先进 WLP（晶圆级封装）、晶圆框架、具图案晶圆、晶圆凸块、WLCSP（晶圆级晶片尺寸封装）、晶圆厚度、表面形貌、薄膜、硅穿孔（TSV）。
• 高解析度晶圆检测
• 具备计量功能的精确细微量测
• 超高速 TSV（硅穿孔）与薄膜计量检测
• 利用 SWIR（短波红外线）模组进行内部缺陷检测*
• 透过 DFF（焦深量测）模组可提供 0.5 / 1 μm 的解析度*
• Class 100 - ISO 5 无尘环境
• TSV 量测能力：侦测 TSV 深度、沟槽深度
• 薄膜量测能力：氧化物、氮化物、光阻（PR）、聚酰亚胺（PI）薄膜厚度
*选配
Optical System
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Imaging Method |
Stop-and-Go Imaging |
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Camera |
25 Mpix |
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Optical Resolution |
2.5 µm |
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Lighting |
Multi-phase True Color LED, Coaxial Lighting |
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3D Technology |
Quad Digital Fringe Projectors |
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Max. 3D Height |
600 μm |
Wafer and Frame Handling
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Wafer |
6", 8", 12" |
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Frame |
8", 12" |
Clean Room
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Clean Room Class |
ISO Class 5 (ISO 14644-1) |
Motion Table & Control
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X Axis Control |
Linear Motor with Motion Controller + Air Bearing or Linear Guide |
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Y Axis Control |
Linear Motor with Motion Controller + Air Bearing or Linear Guide |
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Z Axis Control |
Ball Screw + Linear Guide + AC Servo Motor with Motion Controller or
Linear Guide + Linear Motor with Motion Controller
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X-Y Axis Resolution |
0.1 µm |
Inspection and Metrology Functions
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Patterned Wafer |
Residues, Crack, Scratch, Particle, Pad Abnormal, Discolor, Contamination, Peeling, Probe Mark Defect, CD Measurement
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Bump Wafer |
2D Bump Size, 3D Bump Height, Bump Defect, Foreign Material,
CD Measurement
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Wafer Frame |
Chipping, Crack, Scratch, Particle, Contamination, CD Measurement,
Saw 3D metrology |
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Wafer Topology |
Wafer Thickness, Top-side Warpage |
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TSV |
Sensing TSV depth, Trench depth |
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Thin Film |
Oxide, Nitride, PR, PI film thickness |
Optional Features
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Sensing Technologies* |
3D DFF Module (0.55 or 1 μm), SWIR Module (1, 2 or 4 μm), CSS Module, TSV/Thin Film Module |
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TSV/ Thin Film Module |
Spot Size: 50μm, 25 μm. TSV aspect ratio: Max. 30:1. Via diameter: 3~20 μm.
Film thickness range: 100 nm ~ 30 μm
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Dimensions
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WxDxH |
1235 x 2590 x 2050 mm
Note: Dimensions change according to EFEM |
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Weight** |
2300 kg |
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* You may install either DFF or SWIR, and they are compatible with the TSV/Thin Film and CSS modules.
** Without EFEM Module
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Optical System
| Imaging Method |
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| Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Field of View |
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Inspection Performance
| Imaging Speed |
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| Height Resolution |
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| Max. Solder Height |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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| Z-Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Optical System
| Imaging Method |
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| Top Camera |
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| Angle Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Max. 3D Range |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor |
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Imaging System
| Camera |
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| X-ray Source |
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| Imaging Resolution |
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| Inspection Method |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Dimensions
| WxDxH |
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| Weight |
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| Power Requirement |
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