产品介绍

光学测试设备

TR7007 SII Ultra

INTRODUCTION

TR7007 SII Ultra 是设计专用于 SEMI 后段制程锡膏检测的最新 6 μm 高解析度平台。此款 3D SEMI SPI 具备用于例如锡点间距锡膏量测的计量功能并配备宽光谱光源，可增强对比度并提高缺陷检测率。此外TR7007 SII Ultra 还是一款符合工业 4.0解决方案，可支援闭环反馈/前馈、IPC-CFX 和 IPC Hermes 9852 标准。

应用领域：凸块、助焊剂、胶水、锡膏、表面

• 高速 SEMI 后段制程检测，速度高达 74 cm²/sec
• 透过 TRI SPI 计量功能实现精确的锡膏量测
• 宽光谱光源，可增强对比度并提高缺陷检测率
• 透过 TRI 智能编程，可在数分钟内完成检测就绪
• 支援闭环控制反馈与前馈功能
• 即时 SPC 趋势智能工厂解决方案

Optical System

Imaging Method	Dynamic Scan
Top Camera	4 Mpix
Imaging Resolution	6 µm / 10 µm
Lighting	Wide Spectrum 2D Lights (RGB+W), Coaxial Lighting

Imaging Performance

Max. Imaging Speed

6 μm: 25 cm²/sec ; 10 μm: 74 cm²/sec

Motion Table & Control

X-Axis Control	Linear motor + Linear Scale + EtherCAT Servo
Y-Z Axis Resolution	AC motor with ball screw + EtherCAT Servo
X-Y Axis Resolution	0.5 µm
Z Axis Resolution	1 µm

Board Handling

Max. PCB Size	TR7007 SII Ultra: 510 x 460 mm TR7007 SII Ultra DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane
PCB Thickness	0.5-6 mm
Max. PCB Weight	3 kg
Top Clearance	25 mm
Bottom Clearance	40 mm
Edge Clearance	3 mm
Conveyor	Inline Height: 880 – 920 mm * SMEMA Compatible

Inspection Functions

Applications	Bare Board Bumps Flux Mini-LED Solder Solder Paste
Defects Detected	Insufficient Paste Excessive Paste Shape Deformity Missing Paste Bridging
Measurement	Height Area Volume Offset

Dimensions

WxDxH	TR7007 SII Ultra: 1100 x 1560 x 1710 mm TR7007 SII Ultra DL: 1100 x 1860 x 1710 mm Note: not including signal tower, signal tower height 395 mm
Weight	TR7007 SII Ultra: 740 kg TR7007 SII Ultra DL: 925 kg

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Optical System

Imaging Method
Camera
Imaging Resolution
Lighting
3D Technology
Field of View

Inspection Performance

Imaging Speed
Height Resolution
Max. Solder Height

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Z-Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Defects
Measurement

Dimensions

WxDxH
Weight

Optical System

Imaging Method
Top Camera
Angle Camera
Imaging Resolution
Lighting
3D Technology
Max. 3D Range

Inspection Performance

Imaging Speed

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor

Inspection Functions

Component
Solder

Dimensions

WxDxH
Weight

Imaging System

Camera
X-ray Source
Imaging Resolution
Inspection Method

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Capabilities
Defects

Dimensions

WxDxH
Weight
Power Requirement

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