产品介绍

光学测试设备

TR7007Q SII-S

INTRODUCTION

TR7007Q SII-S 建立于 3.5 μm 高解析度平台，采用 25 MP成像技术，专为 SEMI 后段制程、Mini-LED、C4 凸块（ ~ 100 μm Ø）和 008004 锡膏检测应用而设计。此系统具备更高的准确度与稳定性，可实现精确的锡膏量测并将误判率降至最低。TR7007Q SII-S 配备宽光谱光源系统与同轴照明，以提高多种业界应用的缺陷检测率。这款 3D SEMI SPI 支援现行的智慧工厂标准，包括 IPC-CFX 和 Hermes 标准（IPC-HERMES-9852）。

应用领域：凸块、助焊剂、胶水、Mini-LED 焊锡、锡膏、表面

• 3.5 μm High-Resolution 3D SEMI Back-end, Mini-LED and 008004 solder inspection
• Advanced Wide Spectrum Light for Enhanced Contrast and Detection Rate
• Improved Accuracy and Stability for Precise Solder Measurements
• High Precision Inspection for Multiple Applications
• Industry 4.0 Ready Platform
• Ensures clean operation with HEPA Filter*

*Optional

Optical System

Imaging Method	Stop-and-Go Imaging
Top Camera	25 Mpix
Imaging Resolution	3.5 µm / 6 µm
Lighting	Wide Spectrum 2D Lights (RGB+W), Coaxial Lighting

Imaging Performance

Max. Imaging Speed

2.1 FOV/sec

Motion Table & Control

X-Y-Z Axis Control	Ballscrew + AC Servo with Motion Controller
X-Y-Z Axis Resolution	0.1 µm

Board Handling

Max. PCB Size	TR7007Q SII-S: 450 x 450 mm TR7007Q SII-S DL: 510 x 310 mm x 2 lanes, 510 x 460 mm x 1 lane
PCB Thickness	0.6-5 mm
Max. PCB Weight	3 kg. Optional: 5 kg
Top Clearance	25 mm
Bottom Clearance	40 mm
Edge Clearance	3 mm. Optional: 4 mm / 5 mm
Conveyor	Inline Height: 880 – 920 mm * SMEMA Compatible

Inspection Functions

Applications	Bumps Flux Mini-LED Solder Solder Paste
Defects Detected	Insufficient Paste Excessive Paste Shape Deformity Missing Paste & Bridging
Measurement	Height Area Volume and Offset

Dimensions

WxDxH	TR7007Q SII-S: 1000 x 1480 x @15µm: 1710 mm, @3.5µm / 9.8 µm: 1650 mm TR7007Q SII-S DL: 1000 x 1750 x 1700 mm Note: not including signal tower, signal tower height 520 mm
Weight	TR7007Q SII-S: 795 kg TR7007Q SII-S DL: 840 kg

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Optical System

Imaging Method
Camera
Imaging Resolution
Lighting
3D Technology
Field of View

Inspection Performance

Imaging Speed
Height Resolution
Max. Solder Height

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Z-Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Defects
Measurement

Dimensions

WxDxH
Weight

Optical System

Imaging Method
Top Camera
Angle Camera
Imaging Resolution
Lighting
3D Technology
Max. 3D Range

Inspection Performance

Imaging Speed

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor

Inspection Functions

Component
Solder

Dimensions

WxDxH
Weight

Imaging System

Camera
X-ray Source
Imaging Resolution
Inspection Method

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Capabilities
Defects

Dimensions

WxDxH
Weight
Power Requirement

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