产品介绍

光学测试设备

TR7700Q SII-S

INTRODUCTION

TR7700Q SII-S 建立于 2.5 μm 高解析度平台，采用 25 MP 成像技术，专为半导体与先进封装产业而设计。AI 驱动的演算法与计量功能增强了智能 3D AOI 解决方案的效益。这款 3D SEMI AOI 解决方案可检测直径低至 15 μm（0.6 mil）的线径，并支援目前的智慧工厂标准，包括 IPC-CFX 和 Hermes 标准（IPC-HERMES-9852）。

检测项目包括：打线键合、晶片键合、球形键合、带状键合、楔形键合、系统级封装（SiP）、底部填胶、表面黏着元件（SMD）、凸块以及锡点。

• 2.5 μm 高解析度 3D SEMI 后段制程 AOI
• 精确的计量等级量测*
• 采用 AI 智能编程的 AI 驱动检测*
• 可检测低至 15 μm 尺寸的金、铝、银和铜线
• 键合检测：球形键合、楔形键合和带状键合
• 短波红外光（SWIR）光源，用于检测内部裂纹与崩裂*
• 支援工业 4.0 的平台

*可选配

Optical System

Imaging Method	Stop-and-Go Imaging
Top Camera	12 Mpix / 21 Mpix / 25 Mpix
Imaging Resolution	2.5 µm / 5 µm / 5.5 µm / 7 µm / 8 µm
Lighting	Multi-phase True Color LED

Imaging Performance

Max. Imaging Speed

@2.5 µm: 3.5 cm²/sec (1)
@5 µm: 13 cm²/sec
@5.5 µm: 7.8 cm²/sec
@7 µm: 24 cm²/sec
@8 µm: 29 cm²/sec

* (1) Available for TR7700Q SII-S

Motion Table & Control

X Axis Control	Ballscrew + AC Servo with Motion Controller
Y Axis Control	Dual Driven Ball Screw + AC Servo Motor
Z Axis Control	Ballscrew + AC Servo with Motion Controller
X-Y-Z Axis Resolution	1 µm

Board Handling

Max. PCB Size*	TR7700Q SII-S: 510 x 460 mm, @2.5 μm: 285×150 mm TR7700Q SII-S DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane * Larger PCB size requires additional memory.
PCB Thickness	0.6-5 mm
Max. PCB Weight	3 kg. Optional: 5kg
Top Clearance	TR7700Q SII-S: 20 mm TR7700Q SII-S DL: 20 mm 21MP 8µm: Top Clearance: 50mm
Bottom Clearance	40 mm
Edge Clearance	3 mm. Optional: 4 mm / 5 mm
Conveyor	Inline Height: 880 – 920 mm * SMEMA Compatible

Inspection Functions

Component Defects	Missing Tombstoning Billboarding Polarity Rotation Shift Wrong Marking (OCV) Defective, Upside Down Extra Component Foreign Material Lifted Component
Solder Joint Defects	Solder Fillet Height Solder Volume % Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch/ Contamination
Die Bonding	Missing Orientation Shift Rotation Chipping Crack Scratch Foreign Material Epoxy on Die Epoxy Coverage
Wire Bonding	Broken Short Sweep/Sink Missing Sway Collapse Loop Height Sagged Wire Cross Wire Gap Wire Tracing Ball Bond Diameter Ball Placement Stitch Width Stitch Coverage over Ball Ball-off Pad Ball touch Pad Distance Clubbed Ball Ball Thickness Lifted Ball Low Landing Bond on Contamination Foreign Material
Bonding Area/Pad	Copper Protrusion Crack Chipping Exposed Copper Exposed Nickel Target Material Scratches or Brush Marks Oxidation Foreign Material

Dimensions

WxDxH	TR7700Q SII-S: 1100 x 1720 x 1710 mm TR7700Q SII-S DL: 1100 x 1820 x 1710 mm Note: not including signal tower, signal tower height 515 mm
Weight	TR7700Q SII-S: 910 kg TR7700Q SII-S DL: 960 kg

Please login to access member content

Optical System

Imaging Method
Camera
Imaging Resolution
Lighting
3D Technology
Field of View

Inspection Performance

Imaging Speed
Height Resolution
Max. Solder Height

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Z-Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Defects
Measurement

Dimensions

WxDxH
Weight

Optical System

Imaging Method
Top Camera
Angle Camera
Imaging Resolution
Lighting
3D Technology
Max. 3D Range

Inspection Performance

Imaging Speed

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor

Inspection Functions

Component
Solder

Dimensions

WxDxH
Weight

Imaging System

Camera
X-ray Source
Imaging Resolution
Inspection Method

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Capabilities
Defects

Dimensions

WxDxH
Weight
Power Requirement

返回上一页