INTRODUCTION
The TR7700Q SII-S is the next-generation AI-powered Inspection platform for the Semiconductor & Advanced Packaging Industry. The 3D SEMI AOI is enhanced with metrology capabilities and multiple imaging technologies to achieve full coverage inspection. The 2.5 μm High Resolution platform solution can inspect wire diameters of up to 15 μm (0.6 mil). The 3D AOI supports current Smart Factory Standards, including IPC-CFX and The Hermes Standard (IPC-HERMES-9852).
Inspection for: wire bonding, die bonding, ball bonding, ribbon bond, wedge bond, SiP, underfill, SMD, bumps, and solder joints.
• 2.5 μm High-Resolution 3D SEMI Back-end AOI
• Precise Metrology-Grade Measurements*
• AI-powered Inspection with AI Smart Programming*
• Inspection of Au, Al, Ag, and Cu Wires down to 15 μm dimensions
• Bond Inspection: ball bond, wedge bond, and ribbon bond
• Shortwave Infrared (SWIR) Lighting to detect inner cracks and chipping*
• Industry 4.0 Ready Platform
*Optional
Optical System
Imaging Method
Stop-and-Go Imaging
Top Camera
12 Mpix / 21 Mpix / 25 Mpix
Imaging Resolution
2.5 µm / 5 µm / 5.5 µm / 7 µm / 8 µm
Lighting
Multi-phase True Color LED
Imaging Performance
Max. Imaging Speed
@2.5 µm: 3.5 cm²/sec (1)
@5 µm: 13 cm²/sec
@5.5 µm: 7.8 cm²/sec
@7 µm: 24 cm²/sec
@8 µm: 29 cm²/sec
* (1) Available for TR7700Q SII-S
Motion Table & Control
X Axis Control
Ballscrew + AC Servo with Motion Controller
Y Axis Control
Dual Driven Ball Screw + AC Servo Motor
Z Axis Control
Ballscrew + AC Servo with Motion Controller
X-Y-Z Axis Resolution
1 µm
Board Handling
Max. PCB Size*
TR7700Q SII-S: 510 x 460 mm, @ 2.5 μm: 285×150 mm
TR7700Q SII-S DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane
* Larger PCB size requires additional memory.
PCB Thickness
0.6-5 mm
Max. PCB Weight
3 kg. Optional: 5kg
Top Clearance
TR7700Q SII-S: 20 mm
TR7700Q SII-S DL: 50 mm
Bottom Clearance
40 mm
Edge Clearance
3 mm. Optional: 4 mm / 5 mm
Conveyor
Inline Height: 880 – 920 mm
* SMEMA Compatible
Inspection Functions
Component Defects
Missing
Tombstoning
Billboarding
Polarity
Rotation
Shift
Wrong Marking (OCV)
Defective, Upside Down
Extra Component
Foreign Material
Lifted Component
Solder Joint Defects
Solder Fillet Height
Solder Volume %
Excess Solder
Insufficient Solder
Bridging
Through-hole Pins
Lifted Lead
Golden Finger Scratch/ Contamination
Die Bonding
Missing
Orientation
Shift
Rotation
Chipping
Crack
Scratch
Foreign Material
Epoxy on Die
Epoxy Coverage
Wire Bonding
Broken
Short
Sweep/Sink
Missing
Sway
Collapse
Loop Height
Sagged Wire
Cross Wire Gap
Wire Tracing
Ball Bond Diameter
Ball Placement
Stitch Width
Stitch Coverage over Ball
Ball-off Pad
Ball touch Pad Distance
Clubbed Ball
Ball Thickness
Lifted Ball
Low Landing
Bond on Contamination
Foreign Material
Bonding Area/Pad
Copper Protrusion
Crack
Chipping
Exposed Copper
Exposed Nickel
Target Material
Scratches or Brush Marks
Oxidation
Foreign Material
Dimensions
WxDxH
TR7700Q SII-S: 1100 x 1720 x 1710 mm
TR7700Q SII-S DL: 1100 x 1820 x 1710 mm
Note: not including signal tower, signal tower height 515 mm
Weight
TR7700Q SII-S: 910 kg
TR7700Q SII-S DL: 960 kg
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Optical System
Imaging Method
Camera
Imaging Resolution
Lighting
3D Technology
Field of View
Inspection Performance
Imaging Speed
Height Resolution
Max. Solder Height
Motion Table & Control
X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Z-Axis Resolution
Board Handling
Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height
Optical System
Imaging Method
Top Camera
Angle Camera
Imaging Resolution
Lighting
3D Technology
Max. 3D Range
Motion Table & Control
X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Board Handling
Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor
Imaging System
Camera
X-ray Source
Imaging Resolution
Inspection Method
Motion Table & Control
X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Board Handling
Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height
Dimensions
WxDxH
Weight
Power Requirement