产品介绍

半导体检测机 (SEMI)

TR7720S

INTRODUCTION

TR7720S是一款专为半导体与封装行业设计的小型AI驱动 AOI，可用于检测打线接合、黏晶、SMD和锡点。5.5 μm高分辨率解决方案TR7720S拥有先进测量技术和强化的机械结构，可提供精确和准确的检测结果，能够检测高达50 μm（2mil）的线径。

• 打线接合与黏晶高级封装缺陷检测
• 5.5 μm 高分辨率小型 AOI
• 打线缺陷检测人工智能检测演算法*
• 提升数据可追溯性的量测等级*技术
• 可检测小至 50 μm 的金/铝/银/铜线
• 接合检测：球形接合、楔形接合、带状接合
• 智能工厂实时 SPC 趋势追踪

*选配项目

Optical System

Imaging Method	Stop-and-Go Imaging
Top Camera	12 Mpix
Imaging Resolution	5.5 µm
Lighting	Multi-phase True Color LED, Coaxial Lighting

Imaging Performance

Max. Imaging Speed

10.3 cm²/sec

Motion Table & Control

X-Y-Z Axis Control	Ballscrew + AC Servo with Motion Controller
X-Y-Z Axis Resolution	1 µm

Board Handling

Max. PCB Size	310 x 250 mm
PCB Thickness	0.1-5 mm
Max. PCB Weight	1 kg
Top Clearance	25 mm
Bottom Clearance	40 mm
Edge Clearance	3 mm
Conveyor	Inline Height: 880 – 920 mm * SMEMA Compatible

Inspection Functions

Die Bonding	Missing Orientation Shift Rotation Chipping Crack Scratch Foreign Material Epoxy on Die Epoxy Coverage
Molding / Underfill Materials (EMC, CUF, NCP, NCF, MUF)	Area coverage Shapes/Dimensions Surface Void Damage Crack Scratches Delamination Contamination Surface particles
Bonding Area/Pad	Copper Protrusion Crack Chipping Exposed Copper Exposed Nickel Target Material Scratches or Brush Marks Oxidation Foreign Material

Dimensions

WxDxH	750 x 1460 x 1700 mm Note: not including signal tower, signal tower height 272.5 mm
Weight	710 kg

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Optical System

Imaging Method
Camera
Imaging Resolution
Lighting
3D Technology
Field of View

Inspection Performance

Imaging Speed
Height Resolution
Max. Solder Height

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Z-Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Defects
Measurement

Dimensions

WxDxH
Weight

Optical System

Imaging Method
Top Camera
Angle Camera
Imaging Resolution
Lighting
3D Technology
Max. 3D Range

Inspection Performance

Imaging Speed

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor

Inspection Functions

Component
Solder

Dimensions

WxDxH
Weight

Imaging System

Camera
X-ray Source
Imaging Resolution
Inspection Method

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Capabilities
Defects

Dimensions

WxDxH
Weight
Power Requirement

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