产品介绍

3D 锡膏印刷自动光学检测机 (SPI)

TR7007D SII

INTRODUCTION

TR7007D SII 是一款顶尖的 3D SPI系统，专为提升您的生产流程而设计。凭借其高速平台，此 3D SPI 的检测速度比以往机型快达 50%，可确保最佳效率。体验更出色的精确度与稳定性，实现精密锡膏量测并将误报率降至最低。TR7007D SII 配备宽光谱光源系统与同轴光源（选配），可增强对比度与检出率，让您能以卓越的清晰度捕捉复杂细节。此 3D SPI 为工业 4.0 完备解决方案，支援即将推出的创新协定，例如 IPC-CFX 与 IPC Hermes 9852 标准。　　　

• 宽光谱光源，提升对比度与检出率
• 提升精确度与稳定性，实现精准的锡膏量测
• 全新运动控制器 EtherCAT，实现即时量测
• 100% 无阴影双向数位条纹投影
• 智能板弯补偿功能，消除局部 PCB 变形
• 具备即时 SPC 趋势的智慧工厂解决方案
• 支援闭环 (Closed Loop) 控制：具备反馈与前馈功能

Optical System

Imaging Method	Stop-and-Go Imaging
Camera	21 Mpix or 25 Mpix (factory setting)
Imaging Resolution	9.8 μm, 10 μm, 12 μm,15 μm (factory setting)
Lighting	Wide Spectrum 2D Lights (RGB+W), Coaxial Lighting
3D Technology	2-way Digital Fringe Pattern
Field of View	9.8 μm: 50.30 x 40.24 mm 10 μm: 51.2 x 51.2 mm 12 μm: 62.97 x 50.38 mm 15 μm: 76.8 x 61.4 mm

Inspection Performance

Imaging Speed	2.3 FOV/sec
Height Resolution	9.8 μm: 0.4 μm 10 μm: 0.45 μm 12 μm: 0.45 μm 15 μm: 0.454 μm
Max. Solder Height	9.8 μm: 420 μm 10 μm: 420 μm 12 μm: 420 μm 15 μm: 470 μm * on Calibration Target

Motion Table & Control

X-Axis Control	Ballscrew + AC Servo with EtherCAT Motion Controller
Y-Axis Control	Ballscrew + AC Servo with EtherCAT Motion Controller
Z-Axis Control	Ballscrew + AC Servo with EtherCAT Motion Controller
X-Y Axis Resolution	0.1 μm
Z-Axis Resolution	0.1 μm

Board Handling

Max PCB Size	TR7007D SII: 510 x 460 mm TR7007MD SII: 660 x 610 mm. Optional: 660 x 690 mm TR7007D SII: DL: 510x310 mm x 2 Lanes, 510x590 mm x 1 Lane TR7007LD SII: 765 x 610 mm
PCB Thickness	0.5-6 mm
Max PCB Weight	TR7007MD SII / TR7007D SII (DL): 3 kg. Optional: 5 kg TR7007LD SII: 3 kg. Optional: 5 kg / 12 kg
Top Clearance	TR7007D SII (DL): 25 mm, TR7007MD SII / TR7007LD SII: 50 mm
Bottom Clearance	40 mm
Edge Clearance	3 mm. Optional: 4 mm / 5 mm
Conveyor Height	880 – 920 mm. Optional: 940-965 mm * SMEMA Compatible

Inspection Functions

Defects	Insufficient Paste Excessive Paste Shape Deformity Missing Paste & Bridging
Measurement	Height Area Volume Offset

Dimensions

WxDxH	TR7007D SII: 1000 x 1480 x 1710 mm TR7007MD SII: 1250 x 1740 x 1710 mm TR7007D SII DL: 1000 x 1750 x 1710 mm TR7007LD SII: 1365 x 1720 x 1710 mm Note: not including signal tower
Weight	TR7007D SII: 795 kg TR7007MD SII: 992 kg TR7007D SII DL: 840 kg TR7007LD SII: 1025 kg

Optical System

Imaging Method
Top Camera
Angle Camera
Imaging Resolution
Lighting
3D Technology
Max. 3D Range

Inspection Performance

Imaging Speed

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor

Inspection Functions

Component
Solder

Dimensions

WxDxH
Weight

Imaging System

Camera
X-ray Source
Imaging Resolution
Inspection Method

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Capabilities
Defects

Dimensions

WxDxH
Weight
Power Requirement

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