INTRODUCTION
TR7007D Plus 3D SPI平台配备了优化的运动控制系统（EtherCAT）和高阶的2D照明模组，可以准确地检测低锡桥缺陷及进行板弯补偿以消除PCB制程误差。 TR7007D Plus具有2组数位条纹光投影，以确保进行无阴影检测。 SPI解决方案简化了生产线和MES之间的数据交换流程，实现生产线连接数据的可追溯性。
• 强化2D照明，提供更佳的检测一致性
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Optical System
Imaging Method
Stop-and-Go Imaging
Camera
4 Mpix or 12 Mpix (factory setting)
Imaging Resolution
5.5 μm, 6 μm, 10 μm, 12 μm, 15 µm (factory setting)
Lighting
Enhanced 2D Lights (RGB+W)
3D Technology
2-way Digital Fringe Pattern
Field of View
4 MP Camera Link-
Inspection Performance
Imaging Speed
4 MP Camera Link: Up to 3 FOV/sec
Height Resolution
@10 μm/15 μm: 0.45 μm
Max. Solder Height
@10 μm/15 μm: 420 μm/750 μm
Motion Table & Control
X-Axis Control
Ballscrew + EtherCAT motion controller
Y-Axis Control
Ballscrew + EtherCAT motion controller
Z-Axis Control
Ballscrew + EtherCAT motion controller
X-Y Axis Resolution
0.1 μm
Z-Axis Resolution
0.1 μm
Board Handling
Max PCB Size
TR7007D/DI Plus:@5.5 μm, 6 μm - 400 x 330 mm, @10, 12, 15 μm - 510 x 460 mm
PCB Thickness
0.6 - 5mm
Max PCB Weight
3kg. Optional: 5kg
Top Clearance
@5.5 μm, 6 μm: 25 mm; @10 μm, 12 μm, 15 μm: 50 mm
Bottom Clearance
40 mm
Edge Clearance
3 mm
Conveyor Height
880 – 920 mm
Inspection Functions
Defects
Insufficient Paste
Measurement
Height
Dimensions
WxDxH
TR7007D Plus: 1000 x 1400 x 1650 mm
Weight
TR7007D Plus: 775 kg
Optical System
Imaging Method
Top Camera
Angle Camera
Imaging Resolution
Lighting
3D Technology
Max. 3D Range
Motion Table & Control
X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Board Handling
Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor
Imaging System
Camera
X-ray Source
Imaging Resolution
Inspection Method
Motion Table & Control
X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Board Handling
Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height
Dimensions
WxDxH
Weight
Power Requirement
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