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INTRODUCTION
TR7600HP 是一款专为功率模组（包括 IGBT、MOSFET 及 SiC 逆变器）设计的高功率 CT AXI 系统。其 3D AXI 进阶演算法能有效消除散热片阴影与杂讯，提供清晰且准确的检测结果。TR7600HP 配备 AI 检测演算法、AI 气泡检测及 AI 驱动编程技术，可实现精确且可靠的缺陷检测。此外，TR7600HP 支援智能工厂（Smart Factory Ready），可轻松串接 MES 系统以达成无缝整合。
• 适用于 IGBT、功率模组及逆变器检测的高功率 3D CT AXI
• AI 驱动检测演算法、AI 气泡检测及 AI 自动编程
• 弹性的多解析度平台：支援 7 – 30 μm 解析度
• 产线即时微调，无需中断生产
• 支援检测尺寸达 950 x 530 mm、重量达 12 kg 的电路板
• 智慧工厂简易 MES 串接
• 易于维护且符合辐射安全设计
• 通讯标准：SMEMA, SECS/GEM, IPC-CFX-2591, IPC-HERMES-9852
Optical System
| Imaging Method |
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| Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Field of View |
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Inspection Performance
| Imaging Speed |
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| Height Resolution |
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| Max. Solder Height |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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| Z-Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Optical System
| Imaging Method |
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| Top Camera |
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| Angle Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Max. 3D Range |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor |
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Imaging System
| Camera |
Flat Panel Detector |
| X-ray Source |
40 -180 kV |
| Imaging Resolution |
7 μm - 30 μm |
| Inspection Method |
2D, 2.5D, 3D Slicing, Planar CT (Optional) |
Motion Table & Control
| X-Axis Control |
High-precision ballscrew + AC-servo controller |
| Y-Axis Control |
High-Precision Dual Driven Ball Screw + AC-Servo Controller |
| Z-Axis Control |
High-precision ballscrew + AC-servo controller |
| X-Y Axis Resolution |
N/A |
Board Handling
| Max PCB Size |
950 x 530 mm |
| PCB Thickness |
0.4 - 7 mm |
| Max PCB Weight |
12 kg |
| Top Clearance |
@ 30 μm: 70 mm
@ 25 μm: 70 mm
@ 20 μm: 70 mm
@ 15 μm: 60 mm
@ 10 μm: 30 mm
@ 7 μm: 15 mm |
| Bottom Clearance |
70 mm |
| Edge Clearance |
3 mm or 5 mm |
| Conveyor Height |
880 - 920 mm. Optional: 940 - 965 mm |
Inspection Functions
| Capabilities |
BGAs, Backdrill, Barrel fill, Capacitors, Resistor, Chips, Components Under RF shields, WLCSP, DIMM Connectors, Flip-Chips, Ground Pads, Gullwing, Heat sinks, J-Leads , LED Chips, LGAs, RNET, SiP, SMT Connectors, SOIC, SOT, Thermal Pad, QFNs, QFP and THTs, IGBT |
| Defects |
Missing, Misalignment, Tombstone, Billboard, Tantalum Polarity, Rotation, Insufficient/Excess Solder, Bridging, Open, Solder Ball, Non-Wetting, Void and Lifted Lead |
Dimensions
| WxDxH |
1730 x 2300 x 1980 mm
* not including signal tower, height: 519 mm |
| Weight |
5500 kg |
| Power Requirement |
200 – 240 VAC, Single Phase, 50 / 60 Hz, 4 kVA |
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