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INTRODUCTION
TR7600FB SII 是新一代 AXI，具备全新的 X 射线成像结构设计，提供更清晰的影像。这款智慧型 3D AXI 搭载 AI 检测演算法、AI 气泡检测及编程技术。此 AXI 解决方案可检测大型电路板，尺寸最大可达 850 mm x 520 mm，重量可达 12kg。TR7600FB SII 在不影响生产线产能的情况下，能有效降低漏测与误报。
• 全新X 射线成像结构设计，提供更清晰的影像
• AI 检测演算法、AI 气泡检测与编程
• 5 µm 高精度，实现全方位的缺陷检测
• 新一代机械设计，速度更快，最高可达 20 FOV/s
• 支援多样产品在线微调，无需中断生产
• 大型电路板检测，最大可达 850 mm x 520 mm，重量可达 12 kg
• 智慧工厂简易 MES 串接
• 应用领域：航太、先进封装、车用电子、资料中心、工业物联网（IIOT）、医疗及行动装置
• 通讯标准：SMEMA, SECS/GEM, IPC-CFX-2591, IPC-HERMES-9852
Optical System
| Imaging Method |
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| Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Field of View |
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Inspection Performance
| Imaging Speed |
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| Height Resolution |
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| Max. Solder Height |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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| Z-Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Optical System
| Imaging Method |
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| Top Camera |
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| Angle Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Max. 3D Range |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor |
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Imaging System
| Camera |
Flat Panel Detector |
| X-ray Source |
40 -130 kV |
| Imaging Resolution |
5 μm - 30 μm |
| Inspection Method |
2D, 2.5D, 3D Slicing, Planar CT (Optional) |
Motion Table & Control
| X-Axis Control |
High-precision ballscrew + AC-servo controller |
| Y-Axis Control |
High-precision ballscrew + AC-servo controller |
| Z-Axis Control |
High-precision ballscrew + AC-servo controller |
| X-Y Axis Resolution |
N/A |
Board Handling
| Max PCB Size |
850 x 520 mm |
| PCB Thickness |
0.4 - 7 mm |
| Max PCB Weight |
12 kg |
| Top Clearance |
@ 30 μm: 60 mm
@ 25 μm: 80 mm
@ 20 μm: 90 mm
@ 15 μm: 90 mm
@ 10 μm: 90 mm
@ 5 μm: 90 mm |
| Bottom Clearance |
@ 30 μm: 50 mm
@ 25 μm: 50 mm
@ 20 μm: 50 mm
@ 15 μm: 40 mm
@ 10 μm: 20 mm
@ 5 μm: 10 mm |
| Edge Clearance |
3 mm or 5 mm |
| Conveyor Height |
880 - 920 mm. Optional: 940 - 965 mm |
Inspection Functions
| Capabilities |
BGAs, Backdrill, Barrel fill, Capacitors, Resistor, Chips, Components Under RF shields, WLCSP, DIMM Connectors, Flip-Chips, Ground Pads, Gullwing, Heat sinks, J-Leads , LED Chips, LGAs, Paladin Connector, RNET, SiP, SMT Connectors, SOIC, SOT, Thermal Pad, QFNs, QFP and THTs |
| Defects |
Missing, Misalignment, Tombstone, Billboard, Tantalum Polarity, Rotation, Foreign Material, Insufficient/Excess Solder, Bridging, Open, Solder Ball, Non-Wetting, Void and Lifted Lead |
Dimensions
| WxDxH |
1550 x 2240 x 1800 mm
* not including signal tower, height: 519.5 mm |
| Weight |
3770 kg |
| Power Requirement |
200 – 240 VAC, Single Phase, 50 / 60 Hz, 4 kVA |
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