产品介绍

自动X射线检测机 (AXI)

TR7600F2D QL

INTRODUCTION

TR7600F2D QL 搭载全新机械平台，专为大型电路板检测设计，尺寸最大可达 2100 x 510 mm。提供 5 – 30 µm 的多重高解析度检测。此AXI亦配备专用 2D 相机，支援汽车产业相关应用，如条码读取与基准点检测。TR7600F2D QL 能可靠地检测多种零件缺陷，包含 BGA、电容器、晶片、WLCSP、DIMM 连接器、Flip-Chips、Ground Pads 、Gullwing、散热片、J-Leads、LED 芯片、LGA、Paladin 连接器、电阻、RNET、封装体系（SiP）、SMT 连接器、SOIC、SOT、导热片、QFN、QFP 以及THT。　

• 超大尺寸板边检测，最高可达 2100 x 510 mm
• 灵活的多解析度平台：5 – 30 µm
• 生产不中断的在线微调功能
• AI 驱动检测演算法，实现精准缺陷检测
• 配备 2D 相机，适用于汽车产业的条码读取、基准点检测及光板标记
• 支援智慧工厂，可轻松串接 MES
• 应用领域：伺服器板、LED 灯板、汽车电子控制单元 (ECU) 等

Optical System

Imaging Method
Camera
Imaging Resolution
Lighting
3D Technology
Field of View

Inspection Performance

Imaging Speed
Height Resolution
Max. Solder Height

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Z-Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Defects
Measurement

Dimensions

WxDxH
Weight

Optical System

Imaging Method
Top Camera
Angle Camera
Imaging Resolution
Lighting
3D Technology
Max. 3D Range

Inspection Performance

Imaging Speed

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor

Inspection Functions

Component
Solder

Dimensions

WxDxH
Weight

Imaging System

Camera	Flat Panel Detector
X-ray Source	60 - 130 kV
Imaging Resolution	5 μm - 25 μm
Inspection Method	2D

Motion Table & Control

X-Axis Control	High-Precision Ballscrew + AC-Servo Controller
Y-Axis Control	High-Precision Ballscrew + AC-Servo Controller
Z-Axis Control	High-Precision Ballscrew + AC-Servo Controller
X-Y Axis Resolution	N/A

Board Handling

Max PCB Size	2100 x 510 mm
PCB Thickness	0.6 - 7 mm
Max PCB Weight	12 kg
Top Clearance	@ 20/25 μm: 50 mm @ 15 μm: 40 mm @ 10 μm: 25 mm @ 5 μm: 3 mm
Bottom Clearance	70 mm
Edge Clearance	3 mm or 5 mm
Conveyor Height	880 - 920 mm * SMEMA Compatible

Inspection Functions

Capabilities	BGAs Capacitors Chips Ground Pads Gullwing Resistor RNET SMT Connectors SOIC SOT Thermal Pad QFNs QFP
Defects	Missing Misalignment Tombstone Billboard Tantalum Polarity Rotation Insufficient/Excess Solder Bridging Solder Ball Void

Dimensions

WxDxH	3600 x 2000 x 1940 mm Note: not including signal tower, height: 520 mm
Weight	5800 kg
Power Requirement	200 – 240 VLL , Three phase 4 W, 50 / 60Hz, 7.0 kVA

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