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INTRODUCTION
TR7900Q SII-R은 반도체 및 첨단 패키징 산업을 위한 3D 자동 검사 및 리젝션 스테이션입니다. 3D SEMI AOI는 로더/언로더와 연동할 수 있어 스트립과 매거진을 쉽게 다룰 수 있습니다. 2.5μm 초고해상도 다이 본딩, 볼 본딩, 리본 본드, 웨지 본드, 에폭시, SiP, 언더필, SMD, 범프 및 솔더 조인트를 검사할 수 있습니다. 스파트 팩토리 AOI 솔루션은 최대 15μm(0.6mil) 와이어를 검사할 수 있습니다.
• 와이어 본딩 및 다이본딩을 위한 향상된 패키지 불량 검출
• 불량 식별을 위한 Inking module
• Metrolography-grade* 측정 기능을 갖춘 2.5μm 초고해상도 3D AOI
• 매거진 핸들링을 위한 로더 및 언로더 연동
• AI 알고리즘 기반 와이어 검출*
• Au, Al, Ag, Cu 와이어를 15 μm까지 검사
• 본드 검사: 볼 본드, 웨지 본드 및 리본 본드
• SWIR(Shortwave Infrared) 조명으로 내부 cracks and chipping* 감지
• Clean Room Class 100 - ISO Class 5 (ISO 14644-1)
*옵션 모듈
Optical System
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Imaging Method |
Stop-and-Go Imaging |
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Top Camera |
25 Mpix |
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Imaging Resolution |
2.5 µm |
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Lighting |
Multi-phase True Color LED |
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3D Technology |
Quad Digital Fringe Projectors |
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Max. 3D Height Range |
600 μm |
Defect Marking Method
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Marking Method |
Ink Printer. Optional: Ink Pen |
Motion Table & Control
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X Axis Control |
Linear Motor |
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Y Axis Control |
Dual Linear Motor |
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X-Y Axis Resolution |
0.1 µm |
Board Handling
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Max. Stack Magazine Qty. |
3 Magazines (based on Magazine width 125 mm) |
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Magazine Dimension |
Width: 50 - 175 mm
Length: 120 - 320 mm
Height: 80 - 160 mm
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Strip Dimension |
Width: 35 - 180 mm
Length: 100 - 300 mm
Thickness: 0.1 - 1.5 mm
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Max. Strip Weight |
0.4 kg |
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Strip Carrier / Fixing |
Gripper Conveyor |
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Top Clearance |
15 mm |
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Bottom Clearance |
6 mm |
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Edge Clearance |
3 mm |
Inspection Functions
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Die Bonding |
Missing
Orientation
Rotation
Shift
Tilted
Chipping
Crack
Scratch
Foreign Material
Bond line thickness
Epoxy on Die
Epoxy Coverage
Epoxy Height
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Wire Bonding |
Broken
Short
Sweep/Sink
Missing
Sway
Collapse
Loop Height
Sagged Wire
Cross Wire Gap
Wire Tracing
Ball Bond Diameter
Ball Placement
Stitch Width
Stitch Coverage over Ball
Ball-off Pad
Ball touch Pad Distance
Clubbed Ball
Ball Thickness
Lifted Ball
Low Landing
Bond on Contamination
Foreign Material
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Bonding Area/Pad |
Copper Protrusion
Crack
Chipping
Exposed Copper
Exposed Nickel
Target Material
Scratches or Brush Marks
Oxidation
Foreign Material
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Dimensions
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WxDxH |
2370 x 1455 x 1700 mm
Note: not including signal tower, signal tower height 515 mm |
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Weight |
1120 kg. With Auto Load/Unload Module: 1280 kg |
Optical System
| Imaging Method |
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| Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Field of View |
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Inspection Performance
| Imaging Speed |
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| Height Resolution |
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| Max. Solder Height |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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| Z-Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Optical System
| Imaging Method |
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| Top Camera |
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| Angle Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Max. 3D Range |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor |
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Imaging System
| Camera |
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| X-ray Source |
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| Imaging Resolution |
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| Inspection Method |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Dimensions
| WxDxH |
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| Weight |
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| Power Requirement |
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검색
회원 영역
