|
INTRODUCTION
TR7720S는 와이어 본딩, 다이 본딩, SMD 및 솔더 조인트의 반도체 및 패키징 검사를 위해 AI에 기반한 Compact AOI입니다. Metrology measurements과 튼튼한 메카니컬 구조로 강화된 TR7720S는 정확하고 정밀한 결과를 제공합니다. 5.5 μm 고해상도 AOI는 와이어 직경 최대 50 μm(2 mill)를 검사할 수 있습니다.
• 와이어 본딩 및 다이 본딩을 위한 첨단 패키지 불량 검사
• 5.5 μm 고해상도 컴팩트 AOI
• 와이어 불량검사를 위한 AI 기반 검사 알고리즘*
• 데이터 추적성에 도움이 되는 Metrology-grade 검사*
• 50μm 이하 Au, Al, Ag, Cu 와이어 검사
• 본드검사 : 볼본드, 웨지본드, 리본본드
• Smart Factory Ready - 실시간 SPC Trends
*옵션 모듈
Optical System
Imaging Method |
Stop-and-Go Imaging |
Top Camera |
12 Mpix |
Imaging Resolution |
5.5 µm |
Lighting |
Multi-phase True Color LED, Coaxial Lighting |
Imaging Performance
Max. Imaging Speed |
10.3 cm²/sec |
Motion Table & Control
X-Y-Z Axis Control |
Ballscrew + AC Servo with Motion Controller |
X-Y-Z Axis Resolution |
1 µm |
Board Handling
Max. PCB Size |
310 x 250 mm |
PCB Thickness |
0.1-5 mm |
Max. PCB Weight |
1 kg |
Top Clearance |
25 mm |
Bottom Clearance |
40 mm |
Edge Clearance |
3 mm |
Conveyor |
Inline Height: 880 – 920 mm
* SMEMA Compatible |
Inspection Functions
Die Bonding |
Missing
Orientation
Shift
Rotation
Chipping
Crack
Scratch
Foreign Material
Epoxy on Die
Epoxy Coverage
|
Molding /
Underfill Materials
(EMC, CUF, NCP, NCF, MUF)
|
Area coverage
Shapes/Dimensions
Surface
Void
Damage
Crack
Scratches
Delamination
Contamination
Surface particles
|
Bonding Area/Pad |
Copper Protrusion
Crack
Chipping
Exposed Copper
Exposed Nickel
Target Material
Scratches or Brush Marks
Oxidation
Foreign Material
|
Dimensions
WxDxH |
750 x 1460 x 1700 mm
Note: not including signal tower, signal tower height 272.5 mm |
Weight |
710 kg |
Optical System
Imaging Method |
|
Camera |
|
Imaging Resolution |
|
Lighting |
|
3D Technology |
|
Field of View |
|
Inspection Performance
Imaging Speed |
|
Height Resolution |
|
Max. Solder Height |
|
Motion Table & Control
X-Axis Control |
|
Y-Axis Control |
|
Z-Axis Control |
|
X-Y Axis Resolution |
|
Z-Axis Resolution |
|
Board Handling
Max PCB Size |
|
PCB Thickness |
|
Max PCB Weight |
|
Top Clearance |
|
Bottom Clearance |
|
Edge Clearance |
|
Conveyor Height |
|
Optical System
Imaging Method |
|
Top Camera |
|
Angle Camera |
|
Imaging Resolution |
|
Lighting |
|
3D Technology |
|
Max. 3D Range |
|
Motion Table & Control
X-Axis Control |
|
Y-Axis Control |
|
Z-Axis Control |
|
X-Y Axis Resolution |
|
Board Handling
Max PCB Size |
|
PCB Thickness |
|
Max PCB Weight |
|
Top Clearance |
|
Bottom Clearance |
|
Edge Clearance |
|
Conveyor |
|
Imaging System
Camera |
|
X-ray Source |
|
Imaging Resolution |
|
Inspection Method |
|
Motion Table & Control
X-Axis Control |
|
Y-Axis Control |
|
Z-Axis Control |
|
X-Y Axis Resolution |
|
Board Handling
Max PCB Size |
|
PCB Thickness |
|
Max PCB Weight |
|
Top Clearance |
|
Bottom Clearance |
|
Edge Clearance |
|
Conveyor Height |
|
Dimensions
WxDxH |
|
Weight |
|
Power Requirement |
|
|