솔루션

절연 보호 코팅 검사기 (CI AOI)

TR7700 SIII Ultra CI

INTRODUCTION

TR7700 SIII Ultra CI는 개선된 광학 설계와 코팅을 검사하기 위한 특수 멀티 조명을 갖춘 최첨단 컨포멀 코팅 검사로 코팅 두께를 측정하고 분사된 Flux 및 Glue를 검사할 수 있습니다. TR7700 SIII Ultra CI는 제품생산율을 최적화하고 Connected Factory를 활성화하고자 하는 제조사를 위한 장비입니다.

• 다양한 애플리케이션을 위한 컨포멀 코팅 검사 솔루션
• 코팅 영역 자동 학습 기능을 통한 스마트 프로그래밍
• 레이저 센서*를 사용한 고정밀 코팅 두께 측정
• 업계 최고의 처리량, 고속 검사
• Flux 및 Glue 검사 기능
• 실시간 SPC 트랜드를 활용한 스마트 팩토리
*옵션

Optical System

Imaging Method	Dynamic Imaging
Top Camera	4 Mpix
Imaging Resolution	10 µm, 15 µm (factory setting)
Lighting	Multi-phase RGB+W+UV LED

Imaging Performance

Imaging Speed

@10 µm 2D: 60 cm²/sec
@15 µm 2D: 120 cm²/sec
@10 µm 2D+3D: 27 – 39 cm²/sec
@15 µm 2D+3D: 40 – 60 cm²/sec

Motion Table & Control

X-Y-Z Axis Control	Ballscrew + AC Servo with Motion Controller
X-Y-Z Axis Resolution	1 µm

Board Handling

Max PCB Size	500 x 460 mm
PCB Thickness	0.6-5 mm
Max PCB Weight	3 kg. Optional: 5 kg
Top Clearance	25 mm. Optional: 50 mm
Bottom Clearance	40 mm
Edge Clearance	3 mm. Optional: 5 mm
Conveyor	Inline Height: 880 – 920 mm * SMEMA Compatible

Inspection Functions

Component Defects	Missing Tombstoning Billboarding, Polarity Rotation Shift Wrong Marking (OCV) Defective Upside Down Extra Component Foreign Material Lifted Component
Solder Joint Defects	Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch / Contamination
Conformal Coating	Missing Coating Insufficient Coating Crack Bubble Splash Contamination Spill Coating Thickness Glue Height (3D Laser)

Dimensions

WxDxH	1100 x 1720 x 1710 mm Note: not including signal tower, signal tower height 515 mm
Weight	940 kg

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Optical System

Imaging Method
Camera
Imaging Resolution
Lighting
3D Technology
Field of View

Inspection Performance

Imaging Speed
Height Resolution
Max. Solder Height

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Z-Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Defects
Measurement

Dimensions

WxDxH
Weight

Optical System

Imaging Method
Top Camera
Angle Camera
Imaging Resolution
Lighting
3D Technology
Max. 3D Range

Inspection Performance

Imaging Speed

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor

Inspection Functions

Component
Solder

Dimensions

WxDxH
Weight

Imaging System

Camera
X-ray Source
Imaging Resolution
Inspection Method

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Capabilities
Defects

Dimensions

WxDxH
Weight
Power Requirement

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