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TR7007D/DI Plus
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TR7007D Plus
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INTRODUCTION
TR7007D/DI Plus 3D SPI 플랫폼에는 향상된 모션 컨트롤러(이더캣)와 향상된 2D 조명 모듈이 장착되어 있습니다. TR7007D/DI Plus는 낮은 솔더 브리지를 정확하게 검사하고 PCB 변형을 방지하기 위해서 보드의 뒤틀림을 보상합니다. TR7007D/DI Plus플러스에는 최대 2개의 프로젝터가 장착돼 원활한 shadow-free 검사를 가능하게 합니다. SPI 솔루션은 생산 라인과 MES 간의 데이터 교환을 용이하게 하여 공장의 데이터 추적을 가능하게 합니다.
• 개선된 2D 조명으로 더 높은 균일성 검사를 가능하게 함.
• 실시간 측정을 위한 새로운 모션 컨트롤러, 이더캣.
• 실시간 SPC 트렌드가 포함된 스마트 팩토리 솔루션
• Closed Loop 준비 : 피드백과 피드포워드 가능
Optical System
| Imaging Method |
Stop-and-Go Imaging |
| Camera |
4 Mpix or 12 Mpix (factory setting) |
| Imaging Resolution |
5.5 μm, 6 μm, 10 μm , 15 µm (factory setting) |
| Lighting |
Enhanced 2D Lights (RGB+W) |
| 3D Technology |
2-way Digital Fringe Pattern |
| Field of View |
4 MP Camera Link-
@ 10 μm: 20.3x20.3 mm
@ 15 μm: 30.5x30.5 mm
12 MP Camera Link-
@ 5.5 μm: 22.5x16.5 mm
@ 10 μm: 40.6x30.7 mm
@ 15 μm: 61x46 mm
12 MP CoaXPress-
@ 6 μm: 24.3x18.4 mm
@ 10 μm: 40.6x30.7 mm
@ 15 μm: 61x46 mm |
Inspection Performance
| Imaging Speed |
4 MP Camera Link: Up to 3 FOV/sec
12 MP Camera Link: Up to 1.8 FOV/sec
12 MP CoaXPress: Up to 2.6 FOV/sec |
| Height Resolution |
@10 μm/15 μm: 0.45 μm
@5.5 μm/6 μm: 0.22 μm |
| Max. Solder Height |
@10 μm/15 μm: 420 μm/750 μm
@5.5 μm/6 μm: 210 μm/310 μm
* on Calibration Target |
Motion Table & Control
| X-Axis Control |
Ballscrew + EtherCAT motion controller |
| Y-Axis Control |
Ballscrew + EtherCAT motion controller |
| Z-Axis Control |
Ballscrew + EtherCAT motion controller |
| X-Y Axis Resolution |
0.5 μm |
| Z-Axis Resolution |
1 µm |
Board Handling
| Max PCB Size |
TR7007D/DI Plus:@5.5 μm, 6 μm - 400 x 330 mm, @10 & 15 μm - 510 x 460 mm
TR7007D/DI Plus DL:@10 μm, 15 μm - 510x310 mm x 2 Lanes, 510x590 mm x 1 Lane
TR7007LD Plus:@6 μm, 10 μm, 15 μm - 765 x 610 mm |
| PCB Thickness |
0.6 - 5mm |
| Max PCB Weight |
3kg. Optional: 5kg |
| Top Clearance |
@5.5 μm, 6 μm: 25 mm; @10 μm, 15 μm: 50 mm |
| Bottom Clearance |
40 mm |
| Edge Clearance |
3 mm |
| Conveyor Height |
880 – 920 mm
* SMEMA Compatible
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Inspection Functions
| Defects |
Insufficient Paste
Excessive Paste
Shape Deformity
Missing Paste & Bridging |
| Measurement |
Height
Area
Volume
Offset |
Dimensions
| WxDxH |
TR7007D Plus: 1000 x 1400 x 1650 mm
TR7007D Plus DL: 1000 x 1500 x 1650 mm
TR7007LD Plus: 1365 x 1720 x 1710 mm
TR7007DI Plus: 1000 x 1360 x 1600 mm
TR7007DI Plus DL: 1000 x 1717 x 1600 mm
Note: not including signal tower, signal tower height 515 mm |
| Weight |
TR7007D Plus: 775 kg
TR7007D Plus DL: 825 kg
TR7007LD Plus: 982 kg
TR7007DI Plus: 775 kg
TR7007DI Plus DL: 825 kg
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Optical System
| Imaging Method |
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| Top Camera |
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| Angle Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Max. 3D Range |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor |
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Imaging System
| Camera |
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| X-ray Source |
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| Imaging Resolution |
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| Inspection Method |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Dimensions
| WxDxH |
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| Weight |
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| Power Requirement |
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검색
회원 영역
