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TR7700 SIII Plus
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TR7700 SIII Plus
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INTRODUCTION
TR7700 SIII Plus는 최신 TRI의 AOI 솔루션으로 최고 속도로 정밀한 다상 검사를 제공합니다. 초고속 카메라와 지능형 오토컨베이어, 새로운 GUI를 결합한 TR7700 SIII Plus는 빠른 프로그래밍, 최적화된 보드 로딩, 생산라인 통합 및 오프라인 프로그래밍 지원으로 강력하고 사용하기 쉬운 AOI 솔루션을 제공합니다. TRI의 새로운 컬러 알고리즘은 다상 조명과 결합하여 검출 범위를 늘리고 최소한의 가성불량으로 매우 정확한 검사 결과를 제공합니다.
• 고정밀 풀 스피드의 다상 AOI
• 새로운 GUI 오프라인 편집으로 쉬운 프로그래밍 제공
• 로드 시간 단축을 위한 지능형 자동 컨베이어
• 높은 정확도를 제공하고 오류를 최소화하는 새로운 컬러 알고리즘
Optical System
| Imaging Method |
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| Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Field of View |
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Inspection Performance
| Imaging Speed |
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| Height Resolution |
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| Max. Solder Height |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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| Z-Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Optical System
| Imaging Method |
Dynamic Imaging |
| Top Camera |
4 or 9 or 12 Mpix high speed color camera |
| Angle Camera |
N/A |
| Imaging Resolution |
5.5 µm, 6 µm, 10 µm, 15 µm (factory setting)
Note: 4 MP camera configuration supports 10/15 μm, 9 MP configuration supports 10 μm, 12 MP configuration supports 6 μm. |
| Lighting |
Multi-phase RGB+W LED |
| 3D Technology |
Single/Dual 3D laser sensors (optional) |
| Max. 3D Range |
@5.5 μm: 2 mm
@6 μm: 2 mm
@10 μm: 4 mm
@15 μm: 20 mm
Note: Depending on board size, layout, laser type and/or laser module settings |
Inspection Performance
| Imaging Speed |
@5.5 μm 2D: 24 cm²/sec
@6 µm 2D: 30 cm²/sec
@10 µm 2D: 60 cm²/sec
@15 µm 2D: 120 cm²/sec
@5.5 µm 2D+3D (optional): 4 – 10 cm²/s
@6 µm 2D+3D (optional): 4 – 10 cm²/sec
@10 µm 2D+3D (optional): 27 – 39 cm²/sec
@15 µm 2D+3D (optional): 40 – 60 cm²/sec
Note: Depending on board size, layout, laser type and/or laser module settings
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Motion Table & Control
| X-Axis Control |
Ballscrew + AC-servo controller |
| Y-Axis Control |
Ballscrew + AC-servo controller |
| Z-Axis Control |
N/A |
| X-Y Axis Resolution |
1 µm |
Board Handling
| Max PCB Size |
TR7700 SIII Plus: 510 x 460 mm
TR7700L SIII: 660 x 610 mm
TR7700L SIII Plus: 765 x 610 mm
TR7700 SIII DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane
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| PCB Thickness |
0.6-5 mm |
| Max PCB Weight |
TR7700 SIII Plus: 3 kg
TR7700L SIII: 5 kg
TR7700L SIII Plus: 3 kg. Optional: 5 / 12 kg
TR7700 SIII DL: 3 kg |
| Top Clearance |
25 mm |
| Bottom Clearance |
40 mm |
| Edge Clearance |
TR7700 SIII Plus: 3 mm [5 mm optional]
TR7700L SIII: 5 mm
TR7700L SIII Plus: 3 mm. [4 / 5 mm optional]
TR7700 SIII DL: 3 mm [5 mm optional] |
| Conveyor |
Inline
Height: 880 – 920 mm
* SMEMA Compatible
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Inspection Functions
| Component |
Missing
Tombstoning
Billboarding
Polarity
Rotation
Shift
Wrong Marking (OCV)
Defective
Upside Down
Extra Component
Foreign Material
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| Solder |
Excess Solder
Insufficient Solder
Bridging
Through-hole Pins
Lifted Lead
Golden Finger
Scratch/Contamination
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Dimensions
| WxDxH |
TR7700 SIII Plus: 1100 x 1670 x 1550 mm
TR7700L SIII: 1300 x 1635 x 1655 mm
TR7700L SIII Plus: 1365 x 1720 x 1710 mm
TR7700 SIII DL: 1100 x 1670 x 1550 mm
Note: not including signal tower, signal tower height 520 mm
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| Weight |
TR7700 SIII Plus: 1080 kg
TR7700L SIII: 1240 kg
TR7700L SIII Plus: 1005 kg
TR7700 SIII DL: 1150 kg
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Imaging System
| Camera |
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| X-ray Source |
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| Imaging Resolution |
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| Inspection Method |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Dimensions
| WxDxH |
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| Weight |
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| Power Requirement |
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검색
회원 영역
