INTRODUCTION
Next generation ICT+FCT solution offers breakthrough performance Multi-Core Parallel/Merged Core testing with up to 4 independent cores for high-throughput testing. TRI's most advanced manual handler features industry-approved hands-free safety design for uninterrupted operation, and built-in auto-calibration ensures long-term testing reliability.
• New Generation Flexible Multi-Core Parallel Tester
• State-of-the-Art Serial Test Controller with up to 8 ports on any pin
• Limited access solution and functional test expansion using PXI modules
• Built-in Self Diagnostics and Auto-Calibration function
• High-Accuracy Measurement and Testing
• SMEMA compatible inline high fault coverage test solution
• Intuitive UI with flow-based easy program development
Tester Specifications
Analog/hybrid test points
1 Core- 3,456. Optional: 4,480
Operating System
Microsoft® Windows 11
Fixture Type
Offline with long lifespan Quick Disconnection Interface
Standard Testing Components
Analog Test Hardware
6-wire measurement switching matrix
Programmable AC/DC/DC High voltage and current sources
AC/DC voltage, DC current measurement
Component R/L/C measurement
TestJet vectorless open circuit detection
Arbitrary Waveform Generator
Industry 4.0
Communication Standard
SMEMA, SECS/GEM, IPC-CFX-2591, IPC-HERMES-9852
Yield Management System
YMS 4.0 (Optional)
Optional Components
System Requirement
Power Requirement
200 – 240 V, Single Phase, 50/60 Hz, 3 kVA.
Power Feature
Power Line Earth Ground Auto Detection. Power 50/60 Hz Auto Detection.
Air Requirement
Dry Air 4 – 8 kg/cm2
Dimensions
WxDxH
900 x 1160 x 1860 mm
Weight
440 kg
VIDEO
Optical System
Imaging Method
Camera
Imaging Resolution
Lighting
3D Technology
Field of View
Inspection Performance
Imaging Speed
Height Resolution
Max. Solder Height
Motion Table & Control
X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Z-Axis Resolution
Board Handling
Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height
Optical System
Imaging Method
Top Camera
Angle Camera
Imaging Resolution
Lighting
3D Technology
Max. 3D Range
Motion Table & Control
X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Board Handling
Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor
Imaging System
Camera
X-ray Source
Imaging Resolution
Inspection Method
Motion Table & Control
X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Board Handling
Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height
Dimensions
WxDxH
Weight
Power Requirement
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